(5) Peeling off force: 10gf to 70gf in the direction show below.
Top tape or cover tape
1650~ 1800
Fig. 7.1-5
Base tape
7.2 Storage
a. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to high humidity.
Package must be stored at 40℃ or less and 70% RH or less.
b. The solderability of the external electrode may be deteriorated if packages are stored where they are exposed to dust of harmful gas
(e.g. HCl, sulfurous gas of H2S)
c. Packaging material may be deformed if package are stored where they are exposed to heat of direct sunlight.
d. Minimum packages, such as polyvinyl heat-seal packages shall not be opened until they are used. If opened, use the reels as soon as
possible.
e. Solderability shall be guaranteed for 12 months from the date of delivery on condition that they are stored at the environment specified
in specification. .For those parts, which passed more than 12months shall be checked solder-ability before use.
8. Warning and Attentions
8.1 Precautions on Use
a. Always wear static control bands to protect against ESD.
b. Any devices used (soldering iron, measuring instruments) should be properly grounded.
c. Use non-magnetic tweezers when handing the chips.
d. Pre-heating when soldering, and refer to the recommended condition specified in specification.
e. Don’t apply current in excess of the rated current value. It may cause damage to components due to over-current.
f.
Keep clear of anything that may generate magnetic fields such as speakers, coils.
g. When soldering, the electrical characteristics may be varied due to hot energy and mechanical stress.
h. When coating products with resin, the relatively high resin curing stress may change the electrical characteristics. For exterior coating,
select resin carefully so that electrical and mechanical performance of the product is not affected. Before using, please evaluate
reliability with the product mounted in your application set.
i.
When mount chips with adhesive in preliminary assembly, do appropriate check before the soldering stage, i.e., the size of land
pattern, type of adhesive, amount applied, hardening of the adhesive on proper usage and amounts of adhesive to use.
Mounting density: Add special attention to radiating heat of products when mounting other components nearby. The excessive heat by
other products may cause deterioration at joint of this product with substrate.
j.
k. Since some products are constructed like an open magnetic circuit, narrow spacing between components may cause magnetic
coupling.
l.
Please do not give the product any excessive mechanical shocks in transportation.
m. Please do not touch wires by sharp terminals such as tweezers to avoid causing any damage to wires.
n. Please do not add any shock and power to the soldered product to avoid causing any damage to chip body.
o. Please do not touch the electrodes by naked hand as the solderability of the external electrodes may deteriorate by grease or oil on
the skin.
8.2 PCB Bending Design
The following shall be considered when designing and laying out PCB’s.
a. PCB shall be designed so that products are not subjected to the mechanical stress from board warp or deflection.
Products shall be located in the
sideways direction to the
mechanical stress.
(Poor example)
(Good example)
b. Products location on PCB separation.
C
B
Product shall be located carefully because they may be
subjected to the mechanical stress in order of A>C=B>D.
Separation
D
A
Specifications subject to change without notice. Please check our website for latest informations.
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