Datasheet > FTW1608FE2R2MT

FTW1608FE2R2MT

更新时间： 2024-03-03 10:09:23

品牌	Logo	应用领域
长江微电 - CJIANG		/
页数	文件大小	规格书
10页	1991K
描述
铁氧体绕线

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数据手册

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FTW1608FE2R2MT 数据手册

6.4.7

①

②

No visible mechanical damage.

Inductance change: within ±5%

Re-flowing Profile:

Resistance to

Soldering

Heat

Max: 260℃/10sec

260℃

240℃

200℃

20~40sec.

190℃

Gradual Cooling

150℃

90±30sec.

6.4.8

③

④

No visible mechanical damage.

Inductance change: within ±5%

①

Temperature, Time:

Thermal Shock

-40℃ for 30±3 min→+85℃ for 30±3min

Transforming interval: 20s (max.)

Tested cycle: 100 cycles

②

③

④

The chip shall be stabilized at normal condition for 1~2

hours before measuring.

30 min.

+85℃

Ambient

Temperature

30 min.

-40℃

20s (max.)

6.4.9

①

②

No visible mechanical damage.

Inductance change: within ±5%

①

②

③

Temperature: -40±2℃

Resistance to

Low

Duration: 1000⁺²⁴hours

The chip shall be stabilized at normal condition for 1~2

hours before measuring.

Temperature

6.4.10

①

②

No mechanical damage.

①

②

③

Temperature: 85±2℃

Resistance to

High

Inductance change: within ±5%

Duration: 1000⁺²⁴hours

The chip shall be stabilized at normal condition for 1~2

hours before measuring.

Temperature

6.4.11

①

②

No mechanical damage.

①

②

③

Temperature: 60±2℃, Humidity: 90% to 95% RH

Duration: 1000⁺²⁴hours

Damp Heat

(Steady

States)

Inductance change: within ±5%

The chip shall be stabilized at normal condition for 1~2

hours before measuring.

7. Packaging and Storage

7.1 Packaging

There is one type of packaging for the chip inductors. Please specify the packing code when ordering.

Tape Carrier Packaging:

Packaging code: T

ii.

Tape carrier packaging are specified in attached figure Fig.7.1-1~4

Tape carrier packaging quantity please see the following table:

1608

Punched Tape

Type

Tape

Quantity

Specifications subject to change without notice. Please check our website for latest informations.

WWW.CJIANG.TW

1 2 3 456 7 8...10

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