FSL110D, FSL110R
o
Absolute Maximum Ratings T = 25 C, Unless Otherwise Specified
C
FSL110D, FSL110R
UNITS
Drain to Source Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
100
100
V
V
DS
Drain to Gate Voltage (R
GS
= 20kΩ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V
DGR
Continuous Drain Current
o
T
T
= 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
3.5
2.5
A
A
A
V
C
D
o
= 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
C
D
Pulsed Drain Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
10.5
±20
DM
Gate to Source Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V
GS
Maximum Power Dissipation
o
T
T
= 25 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
15
6
W
W
C
T
o
= 100 C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . P
C
T
o
Linear Derating Factor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Single Pulsed Avalanche Current, L = 100µH, (See Test Figure) . . . . . . . . . . . . . . . . . . . . . .I
0.12
10.5
3.5
W/ C
A
A
A
AS
Continuous Source Current (Body Diode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .I
S
SM
Pulsed Source Current (Body Diode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . I
10.5
-55 to 150
300
o
Operating and Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T , T
C
J
STG
o
Lead Temperature (During Soldering) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . T
(Distance >0.063in (1.6mm) from Case, 10s Max)
C
L
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
o
Electrical Specifications T = 25 C, Unless Otherwise Specified
C
PARAMETER
Drain to Source Breakdown Voltage
Gate Threshold Voltage
SYMBOL
BV
TEST CONDITIONS
= 1mA, V = 0V
MIN
TYP
MAX
-
UNITS
V
I
100
-
DSS
D
GS
o
V
V
= V
,
T
T
T
T
T
T
T
= -55 C
-
1.5
0.5
-
-
5.0
4.0
-
V
GS(TH)
GS
= 1mA
DS
C
C
C
C
C
C
C
I
o
D
= 25 C
-
V
o
= 125 C
-
V
o
Zero Gate Voltage Drain Current
Gate to Source Leakage Current
I
V
V
= 80V,
DS
= 25 C
-
25
µA
µA
nA
nA
V
DSS
= 0V
o
GS
= 125 C
-
-
250
100
200
2.21
0.600
0.960
30
o
I
V
= ±20V
= 25 C
-
-
GSS
GS
o
= 125 C
-
Drain to Source On-State Voltage
Drain to Source On Resistance
V
V
= 12V, I = 3.5A
-
DS(ON)
GS
D
o
r
I
= 2.5A,
T
T
= 25 C
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
0.520
Ω
DS(ON)12
D
C
V
= 12V
o
GS
= 125 C
-
-
Ω
C
Turn-On Delay Time
Rise Time
t
V
R
R
= 50V, I = 3.5A,
ns
ns
ns
ns
nC
nC
nC
nC
nC
V
d(ON)
DD
D
= 14.3Ω, V 12V,
L
GS
t
-
60
r
= 7.5Ω
GS
Turn-Off Delay Time
Fall Time
t
-
30
d(OFF)
t
-
55
f
Total Gate Charge
Q
V
= 0V to 20V
= 0V to 12V
= 0V to 2V
V
= 50V,
-
15
g(TOT)
GS
DD
= 3.5A
I
D
Gate Charge at 12V
Threshold Gate Charge
Gate Charge Source
Gate Charge Drain
Q
V
7.6
-
8.5
0.62
2.8
4.9
-
g(12)
g(TH)
GS
Q
V
GS
Q
2.2
4.3
8
gs
gd
Q
Plateau Voltage
V
I
= 3.5A, V
= 15V
(PLATEAU)
D
DS
= 25V, V = 0V,
GS
Input Capacitance
C
V
155
70
20
-
-
pF
pF
pF
ISS
DS
f = 1MHz
Output Capacitance
Reverse Transfer Capacitance
Thermal Resistance Junction to Case
Thermal Resistance Junction to Ambient
C
C
-
OSS
-
RSS
o
R
8.3
175
C/W
JC
JA
θ
o
R
-
C/W
θ
4-2