Datasheet > FM3V3UD

FM3V3UD

更新时间： 2022-02-26 12:36:58

品牌	Logo	应用领域
未来芯 - FUTUREWAFER		/
页数	文件大小	规格书
5页	489K
描述
Low clamping voltage

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数据手册

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FM3V3UD 数据手册

FM3V3UD

Small Package ESD Protection

Applications

● Lan equipment

● Video

● DVI

● High Speed Data Line

● Ethernet

● USB 2.0 Power and Data line Protection

Feature

● With TVS Diode

● ESD Protection:Level 4

DFN1006-2L

● Low clamping voltage

● 150 Watts peak pulse power per line(tp=8/20uS)

● Ultra low capacitance:300pf max.(I/O to GND.)

● Protection one line I/O port

IEC Compatibility

● EN61000-4

Mechanical Characteristics

● Molded JEDEC DFN1006 package

● Packging:Tape and Reel

● Flammability rating UL 94V-0

● Halgen Free

● 61000-4-2(ESD):Level 4,Contact:±8kv,Air::±15kv

● 61000-4-4(EFT):40A-5/50ns

● 61000-4-5(Surge):4A-8/20us

Device Characteristics

Maximum Ratings@25 unless otherwise specified

Parameter

Symbol

PPP

Value

100

Units

Peak pulse power (tp=8/20us)

Operating Temperature

Watts

-55~150

°c

Storage Temperature

TSTG

Futurewafer Technology Co., Ltd

E1509F2A-STD-FW-012

12 3 4 5

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