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FL201209-2R2K PDF预览

FL201209-2R2K

更新时间: 2022-10-12 13:40:35
品牌 Logo 应用领域
峰瑞科技 - FENGJUI /
页数 文件大小 规格书
7页 262K
描述
EMI SOLOTION PRODUCTS-RoHS

FL201209-2R2K 数据手册

 浏览型号FL201209-2R2K的Datasheet PDF文件第1页浏览型号FL201209-2R2K的Datasheet PDF文件第2页浏览型号FL201209-2R2K的Datasheet PDF文件第3页浏览型号FL201209-2R2K的Datasheet PDF文件第5页浏览型号FL201209-2R2K的Datasheet PDF文件第6页浏览型号FL201209-2R2K的Datasheet PDF文件第7页 
FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS  
Reliability Test  
1. Reflow soldering conditions  
Preheating should be in such a way that the temperature difference between solder and ferrite  
surface is limited to 150max.Also cooling into solvent after soldering should be in such a  
way that the temperature difference is limited to 100max.  
Unenough preheating may cause cracks on the ferrite, resulting in the deterioration of product  
quality.  
Products should be soldered within the following allowable range indicated by the slanted line.  
The excessive soldering conditions may cause the corrosion of the electrode, When soldering  
isrepeated, allowable time is the accumulated time.  
1.1 Reworking with soldering iron  
˙Reworking should be limited to only one time.  
NoteDo not directly touch the products with the tip of the soldering iron in order to  
prevent the crack on the ferrite material due to the thermal shock.  
1.2 Solder Volume  
Solder shall be used not to be exceed the upper limits as shown below.  
Accordingly increasing the solder volume, the mechanical stress to product is also  
increased. Exceeding solder volume may cause the failure of mechanical or electrical  
performance.  
2. IMPEDANCE  
2.1 Impedance shall be measured with HP4291A impedance analyzer or equivalent system  
Your Perfect Inductor  
Ver. 1502  

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