FENG-JUI TECHNOLOGY CO., LTD EMI SOLOTION PRODUCTS-RoHS
●Reliability Test
1. Reflow soldering conditions
Pre-heating should be in such a way that the temperature difference between solder and ferrite
surface is limited to 150℃ max.Also cooling into solvent after soldering should be in such a
way that the temperature difference is limited to 100℃ max.
Unenough pre-heating may cause cracks on the ferrite, resulting in the deterioration of product
quality.
Products should be soldered within the following allowable range indicated by the slanted line.
The excessive soldering conditions may cause the corrosion of the electrode, When soldering
isrepeated, allowable time is the accumulated time.
1.1 Reworking with soldering iron
˙Reworking should be limited to only one time.
Note:Do not directly touch the products with the tip of the soldering iron in order to
prevent the crack on the ferrite material due to the thermal shock.
1.2 Solder Volume
Solder shall be used not to be exceed the upper limits as shown below.
Accordingly increasing the solder volume, the mechanical stress to product is also
increased. Exceeding solder volume may cause the failure of mechanical or electrical
performance.
2. IMPEDANCE
2.1 Impedance shall be measured with HP-4291A impedance analyzer or equivalent system
Your Perfect Inductor
Ver. 1502