Datasheet > FC250F1

FC250F1

更新时间： 2024-02-23 21:42:22

品牌	Logo	应用领域
泰科 - TE		转换器电源电路
页数	文件大小	规格书
20页	1255K
描述
Power Module: dc-dc Converter; 18 Vdc to 36 Vdc Input, 3.3 Vdc Output; 165 W

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FC250F1 技术参数

生命周期：	Obsolete	包装说明：	, MODULE,20LEAD,4.2
Reach Compliance Code：	unknown	风险等级：	5.58
Is Samacsys：	N	最大输入电压：	36 V
最小输入电压：	18 V	端子数量：	20
最大输出电流：	50 A	标称输出电压：	3.3 V
封装主体材料：	METAL	封装等效代码：	MODULE,20LEAD,4.2
封装形式：	MICROELECTRONIC ASSEMBLY	认证状态：	Not Qualified
子类别：	Other Analog ICs	技术：	HYBRID
Base Number Matches：	1

FC250F1 数据手册

Data Sheet

July 2000

FC250F1 Power Module: dc-dc Converter;

18 Vdc to 36 Vdc Input, 3.3 Vdc Output; 165 W

Features

■ Size: 61.0 mm x 116.8 mm x 13.5 mm

(2.40 in. x 4.60 in. x 0.53 in.)

■ Wide input voltage range

■ High efﬁciency: 78% typical

■ Parallel operation with load sharing

■ Adjustable output voltage

■ Overtemperature protection

■ Output voltage set-point adjustment (trim)

■ Synchronization

The FC250F1 Power Module uses advanced, surface-mount

technology and delivers high-quality, compact, dc-dc

conversion at an economical price.

■ Power good signal

■ Output current monitor

■ Output overvoltage and overcurrent protection

■ Remote sense

Applications

■ Remote on/off

■ Redundant and distributed power architectures

■ Computer equipment

■ Constant frequency

■ Case ground pin

■ Communications equipment

■ Input-to-output isolation

■ ISO* 9001 Certiﬁed manufacturing facilities

Options

‡

■ UL^†1950 Recognized, CSA C22.2 No. 950-95

Certiﬁed, and VDE ^§0805 (EN60950, IEC950)

Licensed

■ Heat sinks available for extended operation

Description

The FC250F1 Power Module is a dc-dc converter that operates over an input voltage range of 18 Vdc to 36 Vdc

and provides a precisely regulated dc output. The outputs are fully isolated from the inputs, allowing versatile

polarity conﬁgurations and grounding connections. The module has a maximum power rating of 165 W at a typ-

ical full-load efﬁciency of 78%.

Two or more modules may be paralleled with forced load sharing for redundant or enhanced power applications.

The package, which mounts on a printed-circuit board, accommodates a heat sink for high-temperature

applications.

* ISO is a registered trademark of the International Organization of Standardization.

†UL is a registered trademark of Underwriters Laboratories, Inc.

‡CSA is a registered trademark of Canadian Standards Association.

§VDE is a trademark of Verband Deutscher Elektrotechniker e.V.

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