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FAN5910UCX PDF预览

FAN5910UCX

更新时间: 2023-09-03 20:40:22
品牌 Logo 应用领域
安森美 - ONSEMI GSM
页数 文件大小 规格书
16页 533K
描述
Multi-Mode Buck Converter with LDO Assist for GSM / EDGE, 3G/3.5G and 4G PAs

FAN5910UCX 数据手册

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FAN5910  
Table 1. ABSOLUTE MAXIMUM RATINGS  
Symbol  
Parameter  
Min  
0.3  
0.3  
40  
65  
Max  
Unit  
V
Voltage on AVIN, PVIN  
Voltage on Any Other Pin  
Junction Temperature  
Storage Temperature  
6.0  
V
IN  
AV + 0.3  
IN  
T
+125  
+150  
+260  
°C  
°C  
°C  
kV  
J
T
STG  
T
Lead Soldering Temperature (10 Seconds)  
Electrostatic Discharge Protection Level  
L
ESD  
Human Body Model, JESD22A114  
Charged Device Model, JESD22C101  
2.0  
1.0  
LU  
Latch Up  
JESD 78D  
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality  
should not be assumed, damage may occur and reliability may be affected.  
Table 2. RECOMMENDED OPERATING CONDITIONS  
Symbol  
Parameter  
Min  
2.7  
Typ  
Max  
Unit  
V
V
IN  
Supply Voltage Range  
Output Voltage Range  
5.5  
V
0.35  
<V  
IN  
V
OUT  
OUT_BYPASS  
I
Output Current in Bypass Mode  
Output Current  
4.5  
A
I
2.5  
A
OUT  
L
Inductor  
1.5  
10  
mH  
mF  
mF  
°C  
°C  
C
Input Capacitor (Note 3)  
Output Capacitor (Note 4)  
Operating Ambient Temperature Range  
Operating Junction Temperature Range  
IN  
C
4.7  
OUT  
T
A
40  
40  
+85  
T
J
+125  
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond  
the Recommended Operating Ranges limits may affect device reliability.  
3. The input capacitor must be large enough to limit the input voltage drop during GSM bursts, bypass transitions, and large output voltage  
transitions.  
4. Regulator requires only one 4.7 mF.  
Table 3. DISSIPATION RATINGS  
Symbol  
Parameter  
Min  
Typ  
Max  
Unit  
q
JunctiontoAmbient Thermal Resistance (Note 5)  
40  
°C/W  
JA  
5. Junctiontoambient thermal resistance is a function of application and board layout. This data is measured with fourlayer 2s2p boards  
with vias in accordance to JESD51JEDEC standard. Special attention must be paid not to exceed junction temperature T at a given  
J(MAX)  
ambient temperature T .  
A
www.onsemi.com  
4
 

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