FAN5910
Table 1. ABSOLUTE MAXIMUM RATINGS
Symbol
Parameter
Min
−0.3
−0.3
−40
−65
Max
Unit
V
Voltage on AVIN, PVIN
Voltage on Any Other Pin
Junction Temperature
Storage Temperature
6.0
V
IN
AV + 0.3
IN
T
+125
+150
+260
°C
°C
°C
kV
J
T
STG
T
Lead Soldering Temperature (10 Seconds)
Electrostatic Discharge Protection Level
L
ESD
Human Body Model, JESD22−A114
Charged Device Model, JESD22−C101
2.0
1.0
LU
Latch Up
JESD 78D
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
Table 2. RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
Min
2.7
Typ
Max
Unit
V
V
IN
Supply Voltage Range
Output Voltage Range
5.5
V
0.35
<V
IN
V
OUT
OUT_BYPASS
I
Output Current in Bypass Mode
Output Current
4.5
A
I
2.5
A
OUT
L
Inductor
1.5
10
mH
mF
mF
°C
°C
C
Input Capacitor (Note 3)
Output Capacitor (Note 4)
Operating Ambient Temperature Range
Operating Junction Temperature Range
IN
C
4.7
OUT
T
A
−40
−40
+85
T
J
+125
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
3. The input capacitor must be large enough to limit the input voltage drop during GSM bursts, bypass transitions, and large output voltage
transitions.
4. Regulator requires only one 4.7 mF.
Table 3. DISSIPATION RATINGS
Symbol
Parameter
Min
Typ
Max
Unit
q
Junction−to−Ambient Thermal Resistance (Note 5)
40
°C/W
JA
5. Junction−to−ambient thermal resistance is a function of application and board layout. This data is measured with four−layer 2s2p boards
with vias in accordance to JESD51− JEDEC standard. Special attention must be paid not to exceed junction temperature T at a given
J(MAX)
ambient temperature T .
A
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