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F28M35H22B1RFPQ PDF预览

F28M35H22B1RFPQ

更新时间： 2024-11-19 10:32:43
品牌 Logo 应用领域
德州仪器 - TI 微控制器和处理器外围集成电路时钟
页数 文件大小 规格书
192页 1379K
描述
Concerto Microcontrollers Embedded Memory

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F28M35H22B1RFPQ 技术参数

生命周期：Obsolete零件包装代码：QFP
包装说明：PLASTIC, HTQFP-144针数：144
Reach Compliance Code：unknownHTS代码：8542.31.00.01
风险等级：5.84Is Samacsys：N
具有ADC：YES其他特性：SUPPLY VOLTAGE ALSO OPERATES AT 1.8 V, 3.3 V I/O
地址总线宽度：位大小：32
CPU系列：CORTEX-M3最大时钟频率：20 MHz
DAC 通道：YESDMA 通道：YES
外部数据总线宽度：JESD-30 代码：S-PQFP-G144
长度：20 mmI/O 线路数量：74
端子数量：144最高工作温度：125 °C
最低工作温度：-40 °CPWM 通道：YES
封装主体材料：PLASTIC/EPOXY封装代码：HTFQFP
封装等效代码：TQFP144,.9SQ封装形状：SQUARE
封装形式：FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH电源：1.2,1.8,3.3 V
认证状态：Not QualifiedRAM（字节）：139264
ROM（单词）：524288ROM可编程性：FLASH
筛选级别：AEC-Q100座面最大高度：1.2 mm
速度：100 MHz子类别：Microcontrollers
最大供电电压：1.26 V最小供电电压：1.14 V
标称供电电压：1.2 V表面贴装：YES
技术：CMOS温度等级：AUTOMOTIVE
端子形式：GULL WING端子节距：0.5 mm
端子位置：QUAD宽度：20 mm
uPs/uCs/外围集成电路类型：MICROCONTROLLER, RISCBase Number Matches：1

F28M35H22B1RFPQ 数据手册

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F28M35H20B1, F28M35H20C1  
F28M35H22B1, F28M35H22C1, F28M35H32B1, F28M35H32C1  
F28M35H50B1, F28M35H50C1, F28M35H52B1, F28M35H52C1  
www.ti.com  
SPRS742D –JUNE 2011–REVISED AUGUST 2012  
Concerto Microcontrollers  
1 F28M35x ( Concerto™) MCUs  
1.1 Features  
12345  
• Master Subsystem — ARM® Cortex™-M3  
– 100 MHz  
• Control Subsystem — TMS320C28x™ 32-Bit  
CPU  
– 150 MHz  
– Embedded Memory  
– Embedded Memory  
•
•
•
•
Up to 512KB Flash (ECC)  
Up to 32KB RAM (ECC or Parity)  
Up to 64KB Shared RAM  
2KB IPC Message RAM  
•
•
•
•
Up to 512KB Flash (ECC)  
Up to 36KB RAM (ECC or Parity)  
Up to 64KB Shared RAM  
2KB IPC Message RAM  
– 5 Universal Asynchronous  
Receiver/Transmitters (UARTs)  
– 4 Synchronous Serial Interfaces (SSIs)/  
Serial Peripheral Interface (SPI)  
– 2 Inter-integrated Circuits (I2Cs)  
– Universal Serial Bus On-the-Go (USB-OTG) +  
PHY  
– IEEE-754 Single-Precision Floating-Point  
Unit (FPU)  
– Viterbi, Complex Math, CRC Unit (VCU)  
– Serial Communications Interface (SCI)  
– Serial Peripheral Interface (SPI)  
– Inter-integrated Circuit (I2C)  
– 10/100 ENET 1588 MII  
– 6-Channel Direct Memory Access (DMA)  
– 2 Controller Area Networks (CANs)  
– 32-Channel Direct Memory Access (µDMA)  
– 9 Enhanced Pulse Width Modulator (ePWM)  
Modules  
– Dual Security Zones (128-Bit Password per  
Zone)  
•
18 Outputs (16 High-Resolution)  
– 6 32-Bit Enhanced Capture (eCAP) Modules  
– External Peripheral Interface (EPI)  
– Micro Cyclic Redundancy Check (µCRC)  
Module  
– 3 32-Bit Enhanced Quadrature Encoder  
(eQEP) Modules  
– Multichannel Buffered Serial Port (McBSP)  
– External Peripheral Interface (EPI)  
– One Security Zone (128-Bit Password)  
– 3 32-Bit Timers  
– 4 General-Purpose Timers  
– 2 Watchdog Timer Modules  
– Endianness: Little Endian  
• Clocking  
– Endianness: Little Endian  
– On-chip Crystal Oscillator/External Clock  
Input  
– Dynamic PLL Ratio Changes Supported  
• 1.2-V Digital, 1.8-V Analog, 3.3-V I/O Design  
• Analog Subsystem  
– Dual 12-Bit Analog-to-Digital Converters  
(ADCs)  
– Up to 2.88 MSPS  
– Up to 20 Channels  
– 4 Sample-and-Hold (S/H) Circuits  
• Interprocessor Communications (IPC)  
– 32 Handshaking Channels  
– 4 Channels Generate IPC Interrupts  
– Can be Used to Coordinate Transfer of Data  
Through IPC Message RAMs  
– Up to 6 Comparators With 10-Bit Digital-to-  
Analog Converter (DAC)  
• Package  
• Up to 74 Individually Programmable,  
Multiplexed GPIO Pins  
– 144-Pin RFP PowerPAD™ Thermally  
Enhanced Thin Quad Flatpack (HTQFP)  
– Glitch-free I/Os  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Concerto, TMS320C28x, PowerPAD, C28x, C2000, Piccolo, Delfino, XDS are trademarks of Texas Instruments.  
Cortex is a trademark of ARM Limited.  
ARM is a registered trademark of ARM Ltd or its subsidiaries.  
All other trademarks are the property of their respective owners.  
2
3
4
5
PRODUCT PREVIEW information concerns products in the formative or design phase of  
development. Characteristic data and other specifications are design goals. Texas  
Instruments reserves the right to change or discontinue these products without notice.  
Copyright © 2011–2012, Texas Instruments Incorporated  
 
 
 
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