F0452B Datasheet
Recommended Operating Conditions
Table 3.
Recommended Operating Conditions
Parameter
Symbol
Condition
Minimum
3.15
Typical
Maximum
3.45
Units
V
Power Supply Voltage
VDD
3.3
Operating Temperature Range
RF Frequency Range
TEPAD
fRF
Exposed Paddle
-40
+105
°C
2.3
2.7
GHz
TX Mode CW Average Input Power,
+7.5dB PAR, Full Life Time [a]
PMAX_TX
89% Duty Cycle
89% Duty Cycle
+30[b]
-25
dBm
dBm
50Ω, VDD = +3.3V
RX Mode CW Average Input Power,
+7.5dB PAR, Full Life Time [a]
PMAX_RX
50Ω, VDD = +3.3V
Port Impedance (SW1_IN, SW2_IN,
RX1_OUT, RX2_OUT)
ZRF
TJ
50
Ω
Junction Temperature
+125
°C
[a] Assumes device environmental temperature cycling within the specified exposed pad operating temperature range of -40°C and 105°C and a
maximum junction temperature of 125°C.
[b] Operation beyond the maximum recommended operating input power level should be limited and have reduced exposed pad temperatures to
maintain device reliability per foundry guidelines (see Figure 2). Electrical characteristics and lifetime are not guaranteed for RF input power
levels beyond what is specified in this table.
Figure 2. Typical TX Input Power and Reduced Exposed Pad Temperature Profile
Note: This graph estimates the maximum input power without exceeding the maximum junction temperature of 125°C using an IDT-specific evaluation board
and test environment.
Average Input Power +7.5dB PAR
35
34
33
32
31
30
29
28
27
26
25
60
65
70
75
80
85
90
95 100 105 110 115
Exposed Pad Temperature (°C)
© 2019 Integrated Device Technology, Inc.
8
May 7, 2019