F0452B Datasheet
Pin Descriptions
Table 1.
Pin Descriptions
Number
Name
Description
1-bit 6dB gain control for path 1. (LOW/open = no attenuation; HIGH = 6dB attenuation). A 500kΩ pull-down
resistor is connected between this input and GND.
1
2
ATT1_CTRL
STBY1
Standby (LOW/open = path 1 power ON; HIGH = path 1 power OFF). A 500kΩ pull-down resistor is connected
between this input and GND.
RF SWITCH 1 control (LOW/open = select main RX PATH 1; HIGH = switch output). SW1_CTRL also puts path
3
SW1_CTRL 1 into Standby Mode for minimum current consumption. A 500kΩ pull-down resistor is connected between this
input and GND.
4, 5, 9, 11,
13, 15, 17,
19, 22, 24,
GND
Ground these pins.
26, 28, 30, 32
RF SWITCH 2 control (LOW/open = select main RX PATH 2; HIGH = switch output). SW2_CTRL also puts path
6
7
SW2_CTRL 2 into Standby Mode for minimum current consumption. A 500kΩ pull-down resistor is connected between this
input and GND.
Standby (LOW/open = path 2 power ON; HIGH = path 2 power OFF). A 500kΩ pull-down resistor is connected
between this input and GND.
STBY2
1-bit 6dB gain control for path 2. (LOW/open = no attenuation; HIGH = 6dB attenuation). A 500kΩ pull-down
resistor connects between this input and GND.
8
10
ATT2_CTRL
RX2_OUT
VDD
RF output path 2 matched to 50Ω. Use external DC block as close to the pin as possible.
Power supply. Bypass to GND with capacitors shown in the F0452B Application Circuit (see Figure 30) as close
as possible to the pins.
12, 14, 27, 29
RF2 switch output matched to 50Ω. Use external 50Ω terminating resistor with proper power rating as required
for the application.
16
SW2_OUT
18
23
SW2_IN
SW1_IN
RF2 switch input matched to 50Ω. Use an external DC block as close to the pin as possible.
RF1 switch input matched to 50Ω. Use an external DC block as close to the pin as possible.
RF1 switch output matched to 50Ω. Use an external 50Ω terminating resistor with proper power rating as
required for the application.
25
SW1_OUT
31
RX1_OUT
NC
RF output path 1 matched to 50Ω. Use an external DC block as close to the pin as possible.
20, 21
Not internally connected.
Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple ground
vias to provide heat transfer out of the device into the PCB ground planes. These multiple via grounds are also
required to achieve the specified RF performance.
— EPAD
© 2019 Integrated Device Technology, Inc.
6
May 7, 2019