ESDR0502BT1G

更新时间： 2024-01-14 18:44:25

品牌	Logo	应用领域
安森美 - ONSEMI		瞬态抑制器二极管光电二极管局域网
页数	文件大小	规格书
4页	124K
描述
Transient Voltage Suppressor ESD Protection Diodes with Ultra−Low Capacitance

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ESDR0502BT1G 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	SC-75
包装说明：	S-PDSO-G3	针数：	3
Reach Compliance Code：	unknown	风险等级：	5.8
配置：	SINGLE	二极管元件材料：	SILICON
二极管类型：	TRANS VOLTAGE SUPPRESSOR DIODE	JESD-30 代码：	S-PDSO-G3
JESD-609代码：	e3	湿度敏感等级：	NOT SPECIFIED
元件数量：	1	端子数量：	3
封装主体材料：	PLASTIC/EPOXY	封装形状：	SQUARE
封装形式：	SMALL OUTLINE	峰值回流温度（摄氏度）：	NOT SPECIFIED
极性：	UNIDIRECTIONAL	认证状态：	COMMERCIAL
表面贴装：	YES	技术：	AVALANCHE
端子面层：	MATTE TIN	端子形式：	GULL WING
端子位置：	DUAL	处于峰值回流温度下的最长时间：	NOT SPECIFIED
Base Number Matches：	1

ESDR0502BT1G 数据手册

ESDR0502B

Transient Voltage Suppressor

ESD Protection Diodes with Ultra−Low

Capacitance

The ESDR0502B is designed to protect voltage sensitive

components from damage due to ESD in applications that require ultra

low capacitance to preserve signal integrity. Excellent clamping

capability, low leakage and fast response time are combined with an

ultra low diode capacitance of 0.5 pF to provide best in class

protection from IC damage due to ESD. The small SC−75 package is

ideal for designs where board space is at a premium. The ESDR0502B

can be used to protect two uni−directional lines or one bi−directional

line. When used to protect one bi−directional line, the effective

capacitance is 0.25 pF. Because of its low capacitance, it is well suited

for protecting high frequency signal lines such as USB2.0 high speed

and antenna line applications.

http://onsemi.com

PIN 1. CATHODE

2. CATHODE

3. ANODE

MARKING

DIAGRAM

Specification Features:

• Low Capacitance 0.5 pF Typical

• Low Clamping Voltage

SC−75

CASE 463

STYLE 4

AD M G

• Small Body Outline Dimensions:

0.063” x 0.063” (1.60 mm x 1.60 mm)

• Low Body Height: 0.031″ (0.8 mm)

• Stand−off Voltage: 5 V

= Device Code

= Date Code*

= Pb−Free Package

• Low Leakage

• Response Time is Typically < 1.0 ns

• IEC61000−4−2 Level 4 ESD Protection

• This is a Pb−Free Device

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

ORDERING INFORMATION

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

†

Device

ESDR0502BT1G

Package

Shipping

SC−75

(Pb−Free)

3000/Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

MAXIMUM RATINGS

Rating

IEC 61000−4−2 (ESD)

Peak Surge Power

Symbol

Value

8.0

Unit

Contact

(8 x 20 ms)

Peak Surge Current

2.0

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 2 of this data sheet.

Total Power Dissipation on FR−5 Board

150

(Note 1) @ T = 25°C

Storage Temperature Range

Junction Temperature Range

−55 to +150

260

°C

stg

Lead Solder Temperature − Maximum

(10 Second Duration)

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.62 in.

See Application Note AND8308/D for further description of survivability specs.

Publication Order Number:

June, 2010 − Rev. 0

ESDR0502B/D

12 3 4

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