ESDM3031
ESD Protection Diode
Micro−Packaged Diodes for ESD Protection
The ESDM3031 is designed to protect voltage sensitive components
that require low capacitance from ESD and transient voltage events.
Excellent clamping capability, low capacitance, low leakage, and fast
response time, make these parts ideal for ESD protection on designs
where board space is at a premium.
www.onsemi.com
Features
2
1
• Low Clamping Voltage
• Small Body Outline Dimensions: 0.62 mm x 0.32 mm
• Low Body Height: 0.3 mm
• Stand−off Voltage: 3.3 V
MARKING
DIAGRAM
• IEC61000−4−2 Level 4 ESD Protection
PIN 1
5
X3DFN2
CASE 152AF
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
M
Compliant
Typical Applications
• mSD Card Protection
• Audio Line
5
M
= Specific Device Code
= Date Code
• GPIO
ORDERING INFORMATION
MAXIMUM RATINGS
†
Device
ESDM3031MXT5G
Package
Shipping
Rating
IEC 61000−4−2 (ESD)
Symbol
Value
Unit
X3DFN2
(Pb−Free)
10000 / Tape &
Reel
Contact
Air
30
30
kV
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Total Power Dissipation on FR−5 Board
°P °
250
mW
D
(Note 1) @ T = 25°C
A
Thermal Resistance, Junction−to−Ambient
R
400
−55 to +150
260
°C/W
°C
q
JA
Junction and Storage Temperature Range
T , T
J stg
Lead Solder Temperature − Maximum
(10 Second Duration)
T
L
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the
device. If any of these limits are exceeded, device functionality should not be
assumed, damage may occur and reliability may be affected.
1. FR−5 = 1.0 x 0.75 x 0.62 in.
See Application Note AND8308/D for further description of survivability specs.
© Semiconductor Components Industries, LLC, 2017
1
Publication Order Number:
May, 2017 − Rev. 1
ESDM3031/D