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ESD7561N2T5G PDF预览

ESD7561N2T5G

更新时间: 2024-01-12 15:58:02
品牌 Logo 应用领域
安森美 - ONSEMI /
页数 文件大小 规格书
6页 110K
描述
Ultra-Low Capacitance ESD Protection

ESD7561N2T5G 数据手册

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ESD7561  
Ultra-Low Capacitance ESD  
Protection  
Micro−Packaged Diodes for ESD Protection  
The ESD7561 is designed to protect voltage sensitive components  
that require ultra−low capacitance from ESD and transient voltage  
events. It has industry leading capacitance linearity over voltage  
making it ideal for RF applications. This capacitance linearity  
combined with the extremely small package and low insertion loss  
makes this part well suited for use in antenna line applications for  
wireless handsets and terminals.  
www.onsemi.com  
Features  
MARKING  
DIAGRAM  
Industry Leading Capacitance Linearity Over Voltage  
Ultra−Low Capacitance: 0.3 pF Typ  
Insertion Loss: 0.05 dB at 1 GHz; 0.21 dB at 3 GHz  
Low Leakage: < 1 nA  
X2DFN2  
CASE 714AB  
V M  
G
Protection for the following IEC Standards:  
IEC61000−4−2 (ESD): Level 4 18 kV Contact  
IEC61000−4−4 (EFT): 40 A −5/50 ns  
V
M
= Specific Device Code  
= Date Code  
IEC61000−4−5 (Lightning): 1 A (8/20 ms)  
ISO 10605 (ESD) 330 pF/2 kW 23 kV Contact  
These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
Compliant  
ORDERING INFORMATION  
Device  
Package  
Shipping  
ESD7561N2T5G  
X2DFN2  
(Pb−Free)  
8000 / Tape &  
Reel  
Typical Applications  
RF Signal ESD Protection  
RF Switching, PA, and Antenna ESD Protection  
Near Field Communications  
USB 2.0, USB 3.0  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
MAXIMUM RATINGS (T = 25°C unless otherwise noted)  
A
Rating  
Symbol  
Value  
Unit  
IEC 61000−4−2 (ESD) (Note 1)  
18  
kV  
Total Power Dissipation (Note 2) @ T = 25°C  
°P °  
300  
400  
mW  
°C/W  
A
D
Thermal Resistance, Junction−to−Ambient  
R
q
JA  
Junction and Storage Temperature Range  
T , T  
−55 to  
+150  
°C  
J
stg  
Lead Solder Temperature − Maximum  
(10 Second Duration)  
T
L
260  
°C  
Stresses exceeding those listed in the Maximum Ratings table may damage the  
device. If any of these limits are exceeded, device functionality should not be  
assumed, damage may occur and reliability may be affected.  
1. Non−repetitive current pulse at T = 25°C, per IEC61000−4−2 waveform.  
A
2. Mounted with recommended minimum pad size, DC board FR−4  
© Semiconductor Components Industries, LLC, 2016  
1
Publication Order Number:  
February, 2016 − Rev. 0  
ESD7561/D  
 

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