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ESD7C3.3DT5G PDF预览

ESD7C3.3DT5G

更新时间: 2024-09-28 06:57:55
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
4页 81K
描述
Transient Voltage Suppressors Micro-Packaged Diodes for ESD Protection

ESD7C3.3DT5G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:R-PDSO-F3针数:3
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.50风险等级:1.36
最小击穿电压:5 V配置:COMMON ANODE, 2 ELEMENTS
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码:R-PDSO-F3JESD-609代码:e3
湿度敏感等级:1元件数量:2
端子数量:3最高工作温度:150 °C
最低工作温度:-55 °C封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260极性:UNIDIRECTIONAL
最大功率耗散:0.24 W认证状态:Not Qualified
最大重复峰值反向电压:3.3 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:Tin (Sn)端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:40
Base Number Matches:1

ESD7C3.3DT5G 数据手册

 浏览型号ESD7C3.3DT5G的Datasheet PDF文件第2页浏览型号ESD7C3.3DT5G的Datasheet PDF文件第3页浏览型号ESD7C3.3DT5G的Datasheet PDF文件第4页 
ESD7C3.3DT5G SERIES  
Transient Voltage  
Suppressors  
Micro-Packaged Diodes for ESD Protection  
The ESD7C3.3DT5G Series is designed to protect voltage sensitive  
components from ESD. Excellent clamping capability, low leakage, and  
fast response time make these parts ideal for ESD protection on designs  
where board space is at a premium. Because of its small size, it is suited  
for use in cellular phones, portable devices, digital cameras, power  
supplies and many other portable applications.  
http://onsemi.com  
1
2
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
3
Specification Features:  
ꢀLow Capacitance 6.2 pF to 13 pF  
ꢀLow Clamping Voltage  
MARKING  
DIAGRAM  
ꢀSmall Body Outline Dimensions:  
0.047” x 0.047” (1.20 mm x 1.20 mm)  
ꢀLow Body Height: 0.020(0.5 mm)  
ꢀStand-off Voltage: 3.3 V, 5 V  
ꢀLow Leakage  
L5 M  
SOT-723  
CASE 631AA  
1
L5  
M
= Specific Device Code  
= Date Code  
ꢀResponse Time < 1 ns  
ꢀESD Rating of Class 3 (> 16 kV) per Human Body Model  
ꢀIEC61000-4-2 Level 4 ESD Protection  
ꢀThese are Pb-Free Devices  
*Date Code orientation and/or position may  
vary depending upon manufacturing location.  
Mechanical Characteristics:  
CASE: Void‐free, transfer‐molded, thermosetting plastic  
Epoxy Meets UL 94 V-0  
ORDERING INFORMATION  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
Device  
Package  
Shipping  
ESD7CxxDT5G  
SOT-723 8000/Tape & Reel  
(Pb-Free)  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
MAXIMUM RATINGS  
Rating  
IEC 61000-4-2 (ESD)  
Symbol  
Value  
Unit  
Contact  
Air  
8.0  
15  
kV  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the table on page 2 of this data sheet.  
Total Power Dissipation on FR-5 Board  
(Note 1) @ T = 25°C  
D
P
240  
1.9  
525  
mW  
mW/°C  
°C/W  
A
Derate above 25°C  
Thermal Resistance Junction-to-Ambient  
R
q
JA  
Junction and Storage Temperature Range  
T , T  
J
-55 to  
+150  
°C  
stg  
Lead Solder Temperature - Maximum  
(10 Second Duration)  
T
260  
°C  
L
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR-5 = 1.0 x 0.75 x 0.62 in.  
See Application Note AND8308/D for further description of survivability specs.  
©ꢀ Semiconductor Components Industries, LLC, 2008  
April, 2008 - Rev. 2  
1
Publication Order Number:  
ESD7C3.3D/D  
 

ESD7C3.3DT5G 替代型号

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