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ESD3.3DT5G PDF预览

ESD3.3DT5G

更新时间: 2022-12-22 03:42:38
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
4页 77K
描述
ESD Protection Diodes In Ultra Small SOT-723 Package

ESD3.3DT5G 数据手册

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mESD3.3DT5G SERIES  
ESD Protection Diodes  
In Ultra Small SOT-723 Package  
The mESD Series is designed to protect voltage sensitive components  
from ESD. Excellent clamping capability, low leakage, and fast response  
time, make these parts ideal for ESD protection on designs where board  
space is at a premium. Because of its small size, it is suited for use in  
cellular phones, portable devices, digital cameras, power supplies and  
many other portable applications.  
http://onsemi.com  
1
2
PIN 1. CATHODE  
2. CATHODE  
3. ANODE  
Specification Features:  
3
ꢀSmall Body Outline Dimensions:  
0.047x 0.032(1.20 mm x 0.80 mm)  
ꢀLow Body Height: 0.020(0.5 mm)  
ꢀStand-off Voltage: 3.3 V - 6.0 V  
ꢀLow Leakage  
MARKING  
DIAGRAM  
3
ꢀResponse Time is Typically < 1 ns  
ꢀESD Rating of Class 3 (> 16 kV) per Human Body Model  
ꢀIEC61000-4-2 Level 4 ESD Protection  
ꢀIEC61000-4-4 Level 4 EFT Protection  
ꢀThese are Pb-Free Devices  
2
1
xx M  
SOT-723  
CASE 631AA  
STYLE 4  
xx = Device Code  
= Date Code  
M
Mechanical Characteristics:  
CASE: Void‐free, transfer‐molded, thermosetting plastic  
Epoxy Meets UL 94 V-0  
ORDERING INFORMATION  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
Device  
mESDxxDT5G  
Package  
Shipping  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
SOT-723 8000/Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
MAXIMUM RATINGS  
Rating  
IEC 61000-4-2 (ESD)  
Symbol  
Value  
Unit  
Air  
Contact  
30  
30  
kV  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the table on page 2 of this data sheet.  
IEC 61000-4-4 (EFT)  
40  
A
ESD Voltage  
Per Human Body Model  
Per Machine Model  
16  
400  
kV  
V
Total Power Dissipation on FR-5 Board  
(Note 1) @ T = 25°C  
Derate above 25°C  
Thermal Resistance Junction-to-Ambient  
D
mW  
mW/°C  
°C/W  
P
240  
1.9  
A
R
525  
q
JA  
Junction and Storage Temperature Range  
T , T  
J
-55 to  
+150  
°C  
stg  
Lead Solder Temperature - Maximum  
(10 Second Duration)  
T
L
260  
°C  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR-5 = 1.0 x 0.75 x 0.62 in.  
©ꢀ Semiconductor Components Industries, LLC, 2008  
February, 2008 - Rev. 2  
1
Publication Order Number:  
mESD3.3DT5G/D  
 

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