是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | BGA, BGA324,18X18,40 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.03 |
Is Samacsys: | N | 其他特性: | IT CAN ALSO OPERATE AT 3.3V |
系统内可编程: | YES | JESD-30 代码: | S-PBGA-B324 |
JESD-609代码: | e1 | JTAG BST: | YES |
长度: | 19 mm | 专用输入次数: | |
I/O 线路数量: | 272 | 宏单元数: | 1700 |
端子数量: | 324 | 最高工作温度: | 125 °C |
最低工作温度: | -40 °C | 组织: | 0 DEDICATED INPUTS, 272 I/O |
输出函数: | MACROCELL | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA324,18X18,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 电源: | 1.5/3.3,1.8 V |
可编程逻辑类型: | FLASH PLD | 传播延迟: | 9.1 ns |
认证状态: | Not Qualified | 座面最大高度: | 2.2 mm |
子类别: | Programmable Logic Devices | 最大供电电压: | 1.89 V |
最小供电电压: | 1.71 V | 标称供电电压: | 1.8 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | AUTOMOTIVE | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 19 mm | Base Number Matches: | 1 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
EPM2210GF324A4N | ALTERA | Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 |
获取价格 |
|
EPM2210GF324A4N | INTEL | Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 |
获取价格 |
|
EPM2210GF324C4 | INTEL | Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, FBGA-324 |
获取价格 |
|
EPM2210GF324C4N | INTEL | Flash PLD, 9.1ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 |
获取价格 |
|
EPM2210GF324C5N | INTEL | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA324, 19 X 19 MM, 1 MM PITCH, LEAD FREE, FBGA-324 |
获取价格 |
|
EPM2210GF324I3 | INTEL | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA324 |
获取价格 |