是否Rohs认证: | 符合 | 生命周期: | Active |
包装说明: | BGA, BGA256,16X16,40 | Reach Compliance Code: | compliant |
HTS代码: | 8542.39.00.01 | 风险等级: | 5.01 |
其他特性: | IT CAN ALSO OPERATE AT 3.3V | 系统内可编程: | YES |
JESD-30 代码: | S-PBGA-B256 | JESD-609代码: | e1 |
JTAG BST: | YES | 长度: | 17 mm |
湿度敏感等级: | 3 | 专用输入次数: | |
I/O 线路数量: | 204 | 宏单元数: | 1700 |
端子数量: | 256 | 最高工作温度: | 85 °C |
最低工作温度: | 组织: | 0 DEDICATED INPUTS, 204 I/O | |
输出函数: | MACROCELL | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | BGA | 封装等效代码: | BGA256,16X16,40 |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 电源: | 1.5/3.3,2.5/3.3 V |
可编程逻辑类型: | FLASH PLD | 传播延迟: | 9.1 ns |
认证状态: | Not Qualified | 座面最大高度: | 2.2 mm |
子类别: | Programmable Logic Devices | 最大供电电压: | 2.625 V |
最小供电电压: | 2.375 V | 标称供电电压: | 2.5 V |
表面贴装: | YES | 技术: | CMOS |
温度等级: | OTHER | 端子面层: | Tin/Silver/Copper (Sn/Ag/Cu) |
端子形式: | BALL | 端子节距: | 1 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 40 |
宽度: | 17 mm | Base Number Matches: | 1 |
型号 | 品牌 | 替代类型 | 描述 | 数据表 |
EPM2210F256C3N | INTEL |
完全替代 |
Flash PLD, 7ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 |
型号 | 品牌 | 描述 | 获取价格 | 数据表 |
EPM2210F256C5 | INTEL | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 |
获取价格 |
|
EPM2210F256C5N | ALTERA | The MAX II family of instant-on, non-volatile CPLDs is based on a 0.18-m, |
获取价格 |
|
EPM2210F256C5N | INTEL | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 |
获取价格 |
|
EPM2210F256I5 | INTEL | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, FBGA-256 |
获取价格 |
|
EPM2210F256I5N | ALTERA | Flash PLD, 11.2ns, 1700-Cell, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, LEAD FREE, FBGA-256 |
获取价格 |
|
EPM2210F324A3 | INTEL | Flash PLD, 7ns, 1700-Cell, CMOS, PBGA324, |
获取价格 |