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EPF10K200SPC240-3 PDF预览

EPF10K200SPC240-3

更新时间: 2023-08-15 00:00:00
品牌 Logo 应用领域
阿尔特拉 - ALTERA /
页数 文件大小 规格书
120页 1901K
描述
Loadable PLD, 16ns, CMOS, PQFP240, 34.60 X 34.60 MM, 0.50 MM PITCH, PLASTIC, QFP-240

EPF10K200SPC240-3 数据手册

 浏览型号EPF10K200SPC240-3的Datasheet PDF文件第1页浏览型号EPF10K200SPC240-3的Datasheet PDF文件第2页浏览型号EPF10K200SPC240-3的Datasheet PDF文件第4页浏览型号EPF10K200SPC240-3的Datasheet PDF文件第5页浏览型号EPF10K200SPC240-3的Datasheet PDF文件第6页浏览型号EPF10K200SPC240-3的Datasheet PDF文件第7页 
FLEX 10KE Embedded Programmable Logic Family Data Sheet  
 
 
Software design support and automatic place-and-route provided by  
Altera’s MAX+PLUS® II development system for Windows-based  
PCs and Sun SPARCstation, HP 9000 Series 700/800, and IBM RISC  
System/6000 workstations  
Flexible package options  
Available in a variety of packages with 144 to 672 pins, including  
the innovative FineLine BGATM packages (see Tables 3 and 4)  
SameFrameTM pin-out compatibility with FLEX 10KA and  
FLEX 10KE devices across a range of device densities and pin  
counts  
 
Additional design entry and simulation support provided by EDIF  
2 0 0 and 3 0 0 netlist files, library of parameterized modules (LPM),  
DesignWare components, Verilog HDL, VHDL, and other interfaces  
to popular EDA tools from manufacturers such as Cadence,  
Exemplar Logic, Mentor Graphics, OrCAD, Synopsys, Synplicity,  
VeriBest, and Viewlogic  
Table 3. FLEX 10KE Package Options & I/O Pin Count  
Notes (1), (2)  
Device  
144-Pin 208-Pin 240-Pin 256-Pin 356-Pin 484-Pin 599-Pin 600-Pin 672-Pin  
TQFP  
PQFP  
PQFP  
RQFP  
FineLine  
BGA  
BGA  
FineLine  
BGA  
BGA  
BGA  
FineLine  
BGA  
EPF10K30E  
EPF10K50E  
EPF10K50S  
EPF10K100B  
EPF10K100E  
EPF10K130E  
EPF10K200E  
EPF10K200S  
102  
102  
102  
147  
147  
147  
147  
147  
176  
191  
191  
191  
191  
220  
254  
254  
220 (3)  
254 (3)  
254 (3)  
189  
189  
189  
189  
186  
220  
220  
274  
274  
338  
369  
338 (3)  
413  
424  
470  
470  
470  
470  
470  
182  
274  
369  
470  
Notes:  
(1) FLEX 10KE device package types include thin quad flat pack (TQFP), plastic quad flat pack (PQFP), power quad  
flat pack (RQFP), pin-grid array (PGA), and ball-grid array (BGA) packages.  
(2) Devices in the same package are pin-compatible, although some devices have more I/O pins than others. When  
planning device migration, use the I/O pins that are common to all devices. The MAX+PLUS II software  
versions 9.1 and higher provide features to help designers use only the common pins.  
(3) This option is supported with a 484-pin FineLine BGA package. By using SameFrame pin migration, all  
FineLine BGA packages are pin-compatible. For example, a board can be designed to support 256-pin, 484-pin, and  
672-pin FineLine BGA packages. The MAX+PLUS II software automatically avoids conflicting pins when future  
migration is set.  
Altera Corporation  
3

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