R
EM6812
18 Ordering information Flash device
Packaged Device:
EM6812
Device in DIE Form:
F8 WS 11
F8 TP24 A
EM6812
+
Flash Memory Size:
Flash Memory Size:
F2 = 2k x 22 Bit (5.6 kByte)
F4 = 4k x 22 Bit (11.2 kByte)
F8 = 8k x 22 Bit (22.5 kByte)
F2 = 2k x 22 Bit (5.6 kByte)
F4 = 4k x 22 Bit (11.2 kByte)
F8 = 8k x 22 Bit (22.5 kByte)
Package:
Die form:
SO24 = 24 pin SOIC
TP24 = 24 pin TSSOP
WW = Wafer
WS = Sawn Wafer/Frame
WP = Waffle Pack
Delivery Form:
A = Stick
Thickness:
11 = 11 mils (280um), by default
B = Tape&Reel
27 = 27 mils (686um), not backlapped
In its packaged form, EM6812 is available in green mold / leadfree (symbolized by a “+” at the end of the part number).
Note: Please contact EM Microelectronic for availability of other die thicknesses.
Ordering Part Number (selected examples)
Part Number
Memory Size
Package/Die Form
Delivery Form/Thickness
EM6812F2TP24B+
EM6812F4TP24A+
EM6812F8SO24B+
EM6812F8WS11
2k x 22 bit Flash
4k x 22 bit Flash
8k x 22 bit Flash
8k x 22 bit Flash
24 pin TSSOP
24 pin TSSOP
24 pin SOIC
Sawn wafer
Tape&Reel, 3000 pieces
Stick, 50 pieces
Tape&Reel, 2000 pieces
11 mils
Please make sure to give the complete Part Number when ordering.
Package Marking
SOIC marking:
TSSOP marking:
First line:
Second line:
Third line:
E M
6
P
D
8
P
1
P
2
P
%
P
% % Y
E
P
M
P
6
P
F
8
P
&
1
P
D
2
P
% %
P
F
P
&
P
P
P
P
P
Y
P
P
Where: %%% = specific number assigned by EM
Y = Year of assembly
PP…P = Production identification (date & lot number) of EM Microelectronic
& = memory size (2,4, 8 k Instruction)
EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in
the Company's standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site.
EM assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or
specifications detailed herein at any time without notice, and does not make any commitment to update the information
contained herein. No licenses to patents or other intellectual property of EM are granted in connection with the sale of EM
products, expressly or by implications. EM's products are not authorized for use as components in life support devices or
systems.
© EM Microelectronic-Marin SA, 05/05, Rev. E
81
www.emmicroelectronic.com
Copyright © 2005, EM Microelectronic-Marin SA