R
EM6682
19. Ordering Information
Packaged Device:
Device in DIE Form:
EM6682 WS 11 %%%
EM6682 SO8 A %%%
-
-
Package:
Die form:
SO8 = 8 pin SOIC
TP8 = 8 pin TSSOP
DL8 = 8 pin DIP (note 1)
SO14 = 14 pin SOIC
TP14 = 14 pin TSSOP
WW = Wafer
WS = Sawn Wafer/Frame
WP = Waffle Pack
Thickness:
11 = 11 mils (280um), by default
27 = 27 mils (686um), not backlapped
(for other thickness, contact EM)
Delivery Form:
A = Stick
B = Tape&Reel (for SO8 and TP8 only)
Customer Version:
Customer Version:
customer-specific number
given by EM Microelectronic
customer-specific number
given by EM Microelectronic
Note 1: Please contact EM Microelectronic-Marin S.A. for availability of DIP package for engineering samples. In its
package form, EM6682 is available in Green mold / lead free.
Ordering Part Number (selected examples)
Package/Die
Form
Part Number
Delivery Form/ Thickness
EM6682SO8A-%%% +
EM6682SO8B-%%% +
EM6682SO14A-%%% +
EM6682TP8A-%%%
EM6682TP8B-%%%
EM6682WS11-%%%
EM6682WP11-%%%
8 pin SOIC
8 pin SOIC
14 pin SOIC
8 pin TSSOP
8 pin TSSOP
Sawn wafer
Die in waffle pack
Stick
Tape&Reel
Stick
Stick
Tape&Reel
11 mils
11 mils
Please make sure to give the complete Part Number when ordering, including the 3-digit customer version. The customer
version is made of 3 numbers %%% (e.g. 008 , 012, 131, etc.)
19.1 Package Marking
8-pin SOIC marking:
8-pin TSSOP marking:
First line:
6
6
8
2 % % %
6
6
8
2
Second line:
Third line:
P
P
P
P
P
P
Y
P
P
% %
%
C
P
C C C
14-pin SOIC marking:
14-pin TSSOP marking:
First line:
Second line:
Third line:
E M
6
P
6
P
8
P
2 %
%
P
P
6
P
6
P
8
P
P
2
P
P
% %
P
P
P
P
Y
P
P
P
Y
C C C C C C
Where: %%% or %% = customer version, specific number given by EM (e.g. 008, 012, 131, etc.)
PP…P = Production identification (date & lot number) of EM Microelectronic
Y = year of assembly
CC…C = Customer specific package marking on third line, selected by customer
19.2 Customer Marking
There are 3 digits available for customer marking on SO8, 1 for TSSOP8, 6 for SO14 and 0 for TSSOP14.
Please specify the desired customer marking:
EM Microelectronic-Marin SA (EM) makes no warranty for the use of its products, other than those expressly contained in the Company's
standard warranty which is detailed in EM's General Terms of Sale located on the Company's web site. EM assumes no responsibility for
any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without
notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual
property of EM are granted in connection with the sale of EM products, expressly or by implications. EM's products are not authorized for
use as components in life support devices or systems.
© EM Microelectronic-Marin SA, 01/06, Rev. B
61
www.emmicroelectronic.com
Copyright © 2005, EM Microelectronic-Marin SA