�ꢀꢁꢂꢃꢁꢄꢅꢆꢇꢈꢉꢅꢄꢈꢊꢆꢋꢈꢌꢁꢍꢎꢈꢌꢅꢇꢏꢆꢃꢄ
�ꢀꢁꢂ
�
ꢀ
ꢁ
ꢂ
ꢃ
ꢄ
ꢅ
ꢁ
ꢆ
ꢇ
ꢃ
ꢈ
ꢃ
ꢉ
ꢊ
�ꢀꢀꢁꢂꢃꢃꢄꢄꢄꢅꢆꢁꢇꢈꢉꢊꢋꢌꢍꢀꢇꢋ�ꢅꢋꢍꢉꢎꢎꢎꢏꢐꢑꢑꢒꢎꢓꢔꢕꢖꢆꢁꢇꢈꢎꢎꢎꢏꢐꢑꢑꢒꢎꢓꢔꢕꢖꢗꢘꢙꢚ
INTRODUCTION
PARTS LIST
This easy-to-use kit provides a platform for the evaluation
of power op amps that use the PA74 pin-out configuration. It
can be used to analyze a multitude of standard or proprietary
circuit configurations. In addition, it is flexible enough to do most
standard amplifier test configurations.
Part #
Description
Heatsink
PC Board
Mating Socket
Hardware Kit
Thermal Washer
Quantity
HS11
EVAL02
MS03
HWRE01
TW03
1
1
2
1
The schematic for 1/2 of the PC board is shown in Figure 2.
The schematic for the other half is identical except part refer-
ence designators are primed (i.e. R1 = R1'). Note that all of
the components shown on the schematic will probably not be
used for any single circuit. The component locations on the PC
board (See Figure 3) provide maximum flexibility for a variety
of configurations. Also included are loops for current probes as
well as connection pads on the edge of the PC board for easy
interconnects.
The hardware required to mount the PC board and the device
under evaluation to the heatsink are included in the kit. Because
of the limitless combination of configurations and component
values that can be used, no other parts are included in this kit.
However, generic formulas and guidelines are included in the
APEX DATABOOK and this evaluation kit documentation.
1 Box/10
HWRE01 contains the following:
4
4
4
#8 Panhead Screw
#8 .375" Hex Spacer
#8 1.00" Hex Standoff
4
4
2
#6 x 1.25" Panhead Screw
#6 x 5/16" Hex Nut
#6 x 1/4" Hex Nut
ASSEMBLY HINTS
The mating sockets included with this kit have recessed
nut sockets for mounting the device under evaluation. This
allows assembly from one side of the heatsink, making it easy
to swap devices under evaluation. The sizes of the stand-offs
wereselectedtoallowproperspacingoftheboard-to-heatsink
and allow enough height for components when the assembly
is inverted.
ASSEMBLY
BEFORE YOU GET STARTED
1. Inserta#6x5/16"hexnutineachofthenutsocketrecesses
located on the bottom of the mating socket.
•
All Apex amplifiers should be handled using proper ESD
precautions!
2. Insert the socket into the pc board until it is firmly pressed
against the ground plane side of the pc board.
3. Solder the socket in place (see Figure 1). Be sure the nuts
are in the recesses prior to soldering.
4. Mount the PC board assembly to the heatsink using the
stand-offs and spacers included.
5. Apply thermal grease or a TW03 to the bottom of the device
under evaluation. Insert into the mating socket through the
heatsink.
6. Usethe#6x1.25"panheadscrewstomounttheamplifierto
the heat sink. Do not overtorque. Recommended mounting
torque is 4-7 in-lbs (.45-.79 N•M).
•
Initiallysetallpowersuppliestotheminimumoperatinglevels
allowed in the device data sheet.
•
•
Check for oscillations.
Alwaysusetheheatsinkincludedinthiskitwiththermalgrease
or a TW03 and torque the part to the specified 4-7 in-lbs
(.45-.79 N•M).
•
•
Do not change connections while the circuit is under pow-
er.
Never exceed any of the absolute maximums listed in the
device data sheet.
•
•
•
Always use adequate power supply bypassing.
Remember that internal power does not equal load power.
Do not count on internal diodes to protect the output against
sustained, high frequency, high energy kickback pulses.
Mounting precautions, general operating considerations,
and heatsinking information may be found in the APEX DATA
BOOK.
NOTE: Refer to HS11 Heatsink in Accessories section
Figure 1
ꢝꢀꢛꢏꢎꢈꢄꢜ
ꢐꢃꢘꢀꢙꢅꢌꢍꢅꢚꢒꢍ
ꢐꢛꢕꢜꢛꢉꢀ
ꢡꢫꢅꢞꢕꢙꢀꢘ
ꢡꢢꢅꢞꢕꢙꢀꢘ
ꢡꢢꢅꢣꢤꢥꢦꢧ
ꢝꢀꢨꢅꢞꢍꢛꢕꢀꢙ
ꢔꢀꢕꢀꢎꢎꢀꢖꢅꢗꢆꢏꢎ
ꢡꢢꢅꢩꢣꢪꢪꢧ
ꢝꢀꢨꢅꢞꢏꢛꢄꢖꢃꢁꢁ
�ꢀꢁꢂꢃꢄꢅ�ꢆꢇꢈꢄꢉ
ꢊꢋꢅꢌꢍꢍꢃꢎꢈꢏꢀꢅꢐꢈꢄꢎ
ꢑꢈꢄꢈꢒꢆꢒꢓ
ꢐꢟꢅꢠꢃꢛꢙꢖ
ꢑꢛꢏꢈꢄꢉꢅꢞꢃꢕꢜꢀꢏ
APEX MICROTECHNOLOGY CORPORATION • TELEPHONE (520) 690-8600 • FAX (520) 888-3329 • ORDERS (520) 690-8601 • EMAIL prodlit@apexmicrotech.com
1
5秒后页面跳转
?TPA3116D2功放芯片参数详解、引脚说明
74HC165引脚说明、驱动程序示例解读
深入解析AD9833：DDS频率合成器的卓越性能与广泛应用
高性能TDA7293音频功率放大器技术特性与应用分析
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
技术参数
数据手册
如果您发现信息不准确，
