EGBU1006
Thermal Characteristics (T =25℃Unless otherwise specified)
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a
EGBU1006
PARAMETER
SYMBOL
UNIT
Between junction and ambient,
Without heatsink
R
20
2
θJ-A
Thermal
Resistance
℃/W
Between junction and case,
With heatsink
R
θJ-C
Note: Device mounted on 75mm x 45mm x 5.5mm Aluminum Plate Heatsink.
Ordering Information (Example)
■
■
PACKING
MINIIMUM
PACKAGE(pcs) QUANTITY(pcs)
INNER BOX
OUTER CARTON DELIVERY
PREFERED P/N
CODE
UNIT WEIGHT(g)
QUANTITY(pcs)
MODE
B1
Approximate 3.96
20
1000
2000
TUBE
EGBU1006
Characteristics (Typical)
FIG2:Surge Forward Current Capability
FIG1:Io-Tc Curve
262.5
175
87.5
0
12
half sine wave
10
0
heatsink
8.3ms 8.3ms
Tc
1cycle
8.0
6.0
4.0
2.0
non-repetitive
Tj=25℃
with heatsink
without heatsink
0
80
90
100 110 120 130 140 150
Case Temperature(℃)
160
1
2
5
10
20
50
100
Number of Cycles
FIG4:Typical Reverse Characteristics
FIG3: Typical Forward Voltage
100
10
60
40
20
10
Tj=125℃
5.0
1.0
2.0
1.0
0.1
0.5
Tj=25℃
0.2
0.1
0.01
0
20
40
60
80
100
2.6
0.6
1.0
1.4
1.8
2.2
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Forward Voltage(V)
2 / 4
Yangzhou Yangjie Electronic Technology Co., Ltd.
S-B2903
Rev.1.1,29-Jan-24
www.21yangjie.com