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EG08003-GM

更新时间: 2024-11-19 20:44:43
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富士康 - FOXCONN /
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EG08003-GM 数据手册

  
SPECIFICATIONS  
MCA Connector  
EG Series  
Mechanical  
Vertical, T/H Type  
1.27mm [.050"] Pitch  
160 Pos.  
Insertion Force: 227gf max. Use 1.78mm Thickness Gauge  
Separation Force: 19gf min. Use 1.37mm Thickness Gauge  
Durability: 100 Cycles min.  
Retention Force: 0.40kgf min.  
Electrical  
Current Rating: 0.5A, 30Rise above Ambient  
Contact Resistance: 30mW max. initial, 40mW max. after Test  
Dielectric Withstand Voltage: 500V min. at Sea Level  
Pin to Pin Insulation Resistance: 1000MW min.  
Physical  
Housing: Thermoplastic, UL 94V-0 rated in Brown Color  
Contact: Copper alloy  
Plating: See “ORDERING INFORMATION”  
Storage Temperature Range: -55to +85℃  
DRAWING  
ORDERING INFORMATION  
PRODUCT NO.: EG 0 80 0 * - * M  
Series Prefix  
1.27 [.005] Pitch  
Low Profile MCA  
Card Edge Conn.  
Board Lock Type  
M=Metal Hold Down  
Contact Area Plating  
G=Gold Plating  
R=20u" Pd/Ni+GOLD  
Termination Type  
0=Straight  
Gold Plating  
1=Gold Flash  
3=30u" Gold  
6=10u" Gold  
7=15u" Gold  
No. of Pos.  
80=160 Pos.  
Tail Length  
0=3.18 [.125]  
All specification & dimensions are subject to change, please call your nearest Foxconn sales representative for update information.  

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