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EFP201209L050B PDF预览

EFP201209L050B

更新时间: 2022-05-14 22:06:01
品牌 Logo 应用领域
百容 - ECE /
页数 文件大小 规格书
5页 182K
描述
HIGH CURRENT MULTILAYER CHIP BEADS

EFP201209L050B 数据手册

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ECE  
The Name You Can Trust!  
HIGH CURRENT MULTILAYER CHIP BEADS  
EFP SERIES  
DIMENSIONS  
FEATURES  
These high current Beads do not require  
wiring, with minimum capacity and lower  
DC resistance characteristic, they are  
designed to eliminate EMI for electrical  
equipment power line use.  
Terminal  
electrode  
B
Ferrite  
Available in high current which up to 6A.  
Closed magnetic circuit avoids crosstalk,  
suitable for high density PCB.  
D
D
A
Excellent for high current applications  
such as power supplies, industrial  
Equipment, OA products, communication  
products etc..  
C
UNIT: mm  
Type  
A
B
C
D
EFP100505(0402)  
EFP160808(0603)  
EFP201209(0805)  
EFP321611(1206)  
1.0±0.10  
1.6±0.20  
2.0±0.20  
3.2±0.20  
0.5±0.10  
0.8±0.15  
1.25±0.20  
1.60±0.20  
0.5±0.10  
0.8±0.15  
0.9±0.20  
1.1±0.20  
0.1~0.4  
0.2~0.6  
0.2~0.8  
0.4~1.0  
PART NUMBERING SYSTEM  
EFP 321611 L 121 1 A Z  
Z: RoHS Compliant  
Endurance Current: A, B  
Packing:  
1: Tape and 7" Reel  
Impedance:  
121: 120  
Material Code:  
Dimensions:  
Length(mm) x Width(mm) x Thickness(mm)  
Product Name:  
High Current Multilayer Chip Beads  
1
For the latest product information, Please visit our website at http://www.ece.com.tw  

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