Ceramic Resonators, Chip Type
Ceramic Resonators, Chip Type
(2 Array Type)
Type:
EFOP
EFOD
EFOPS
EFOPM
EFODM
EFOLM
Type:
Type:
Type:
Type:
Type:
■ Features
■ Recommended Applications
● Clock generator for microprocessors
● Carrier circuit between telecommunication equipment
(Telephone to telephone, personal computer to printer)
● Encased in a ceramic package
● High reliability against soldering heat and mechanical
stress
● Moisture-proof sealing
(See Page 175 to 176)
■ Handling Precautions
● 1.2 mm maximum in thickness (PS/PM/DM/LM)
● Designed for reflow soldering
● Flat-bottom plate for better mounting
● RoHS compliant
■ Packaging Specifications
See Page 174, 177
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
12
E
F
O
3
5
8
4
Design No.
Nominal Oscillation
Frequency
Frequency
Tolerance
Product Code
Ceramic
Type
Packaging Style
B
Bulk Pack
Chip Type with 2-terminals
EFO
3584
3.58 MHz
Resonators
0
1.0 %
0.3 %
0.5 %
Embossed
Taping
2 to 13 MHz
13.1 to 20 MHz
P
D
E
1695 16.93 MHz
(Example)
3
5
1
2
3
4
5
6
7
8
9
10
11
12
E
F
O
4
0
0
4
Design No.
Nominal Oscillation
Frequency
Frequency
Tolerance
Product Code
Ceramic
Type
Packaging Style
B
Bulk Pack
Chip Type with 2-terminals
EFO
4004
4.00 MHz
Resonators
0
3
5
1.0 %
0.3 %
0.5 %
Embossed
Taping
4 to 13 MHz
16 to 20 MHz
30 to 50 MHz
4 to 13 MHz
12 to 20 MHz
PM
E
1695 16.93 MHz
LM
4005
40.0 MHz
(Example)
PS
DM
Frequency range
(MHz)
Frequency Temperature Characteristics
(–20 to +80 °C)
Attached Capacitors
(Reference)
Part Number
2.00 to 8.39
8.40 to 13.0
13.1 to 20.0
4.00 to 8.39
8.40 to 13.0
4.00 to 8.39
8.40 to 13.0
12.0 to 20.0
16.0 to 20.0
30.0 to 50.0
0.3 %
1.0 %
1.0 %
0.6 %
1.0 %
0.3 %
1.0 %
1.0 %
1.0 %
0.3 %
EFOP
EFOD
33 pF
33 pF
21 pF
EFOPS
EFOPM
EFODM
EFOLM
33 pF
18 pF
10 pF
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
00 Apr. 2008
– EC171 –