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ECEA1HGE2R2 PDF预览

ECEA1HGE2R2

更新时间: 2023-01-15 00:00:00
品牌 Logo 应用领域
松下 - PANASONIC /
页数 文件大小 规格书
9页 174K
描述
CAPACITOR, ALUMINUM ELECTROLYTIC, NON SOLID, POLARIZED, 50V, 2.2uF, THROUGH HOLE MOUNT, RADIAL LEADED

ECEA1HGE2R2 数据手册

 浏览型号ECEA1HGE2R2的Datasheet PDF文件第3页浏览型号ECEA1HGE2R2的Datasheet PDF文件第4页浏览型号ECEA1HGE2R2的Datasheet PDF文件第5页浏览型号ECEA1HGE2R2的Datasheet PDF文件第6页浏览型号ECEA1HGE2R2的Datasheet PDF文件第8页浏览型号ECEA1HGE2R2的Datasheet PDF文件第9页 
Aluminum Electrolytic Capacitor  
2.4 Flow Soldering  
2.6Other Soldering Considerations  
Rapid temperature rises during the preheat  
operation and resin bonding operation can cause  
cracking of the capacitor vinyl sleeve. For heat  
curing, do not exceed 150°C for a maximum time of  
2 minutes.  
(1) Don not immerse the capacitor body into the  
solder bath as excessive internal pressure could  
result.  
(2) Observe proper soldering conditions (temperature,  
time, etc.). Do not exceed the specified limits.  
(3) Do not allow other parts or components to touch  
the capacitor during soldering.  
2.7Capacitor Handling after Soldering  
(1) Avoid movement of the capacitor after soldering  
to prevent excessive stress on the leadwires  
where they enter the seal.  
(2) Do not use the capacitor as a handle when  
moving the circuit board assembly.  
2.5 Reflow Soldering for Chip Capacitors  
(1) For reflow, use a thermal conduction system such  
as infrared radiation (IR) or hot blast. Vapor heat  
transfer systems (VPS) are not recommended.  
(2) Observe proper soldering conditions (temperature,  
time, etc.). Do not exceed the specified limits.  
(3) Reflow should be performed one time. Consult us  
for additional reflow restrictions.  
(3) Avoid striking the capacitor after assembly to  
prevent failure due to excessive shock.  
5(s)  
250  
Peak  
temperature  
2.8 Circuit Board Cleaning  
(1) Circuit boards can be immersed or ultrasonically  
cleaned using suitable cleaning solvents for up  
to 5 minutes and up to 6 0 ° C m a x imum  
temperatures. The boards should be thoroughly  
rinsed and dried.  
200  
160°C  
150  
Time in  
200°C or more  
120(s)  
Time  
100  
50  
Recommended cleaning solvents include  
Pine Alpha ST-100S, Sunelec B-12, DK Beclear  
CW-5790, Aqua Cleaner 210SEP, Cold Cleaner  
P3-375, Telpen Cleaner EC-7R, Clean-thru 750H,  
Clean-thru 750L, Clean thru 710M, Techno  
Cleaner 219, Techno Care FRW-17, Techno  
Care FRW-1, Techno Care FRV-1, IPA (isopropyl  
alcohol)  
Chip capacitor reflow guaranteed condition  
240  
230  
220  
210  
The use of ozone depleting cleaning agents are  
not recommended in the interest of protecting  
the environment.  
0
10  
20  
30 40  
50  
60  
(2) Avoid using the following solvent groups unless  
specifically allowed for in the specification;  
Halogenated cleaning solvents: except for solvent  
resistant capacitor types, halogenated solvents  
can permeate the seal and cause internal  
capacitor corrosion and failure. For solvent  
resistant capacitors, carefully follow the  
temperature and time requirements of the  
specificaion. 1-1-1 trichloroe thane should never  
be used on any aluminium electrolytic capacitor.  
Alkali solvents: could attack and dissolve the  
aluminum case.  
Time in 200°C or more (s)  
(φ3 to 6.3φ)  
240  
230  
220  
210  
0
10  
20  
30  
40 50  
60  
Time in 200°C or more (s)  
(φ8 to φ10)  
Petroleum based solvents: deterioration of the  
rubber seal could result.  
Xylene: deterioration of the rubber seal could  
result.  
Acetone: removal of the ink markings on the  
vinyl sleeve could result.  
EB Series  
240  
230  
220  
210  
Temperature measuring method: Measure  
temperature in assuming quantitative production, by  
sticking the thermo-couple to the capacitor upper  
0
10 20 30 40 50 60  
Time in 200°C or more (s)  
(φ10 to φ18)  
part with epoxy adhesives.  
Design, Specifications are subject to change without notice. Ask factory for technical specifications before purchase and/or use.  
Whenever a doubt about safety arises from this product, please inform us immediately for technical consulation without fail.  
Mar. 2005  
EE20 –  

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