E-Beam Welded Shunt 5216
EBW5216
Performance Data
Test
Methods
±ΔR% max.
Load Life
Short Term Overload
1000 hours, cyclic load at Pr
5 seconds, 5 × Pr
1
1
High Temperature Exposure 1000 hours, +170°C
1
Temperature Cycle
Low Temperature Storage
Biased Humidity
Moisture Resistance
Vibration
Mechanical Shock
Resistance to Solder Heat
Solderability
1000 cycles, -55 to +150°C, 30 minute dwell
24 hours, -65°C
1000 hours, 85°C/85%RH, 10% of Pr
MIL-STD-202 Method 106, no load
MIL-STD-202 Method 204, 5g for 20 mins, 12 cycles, 10 - 2000Hz
MIL-STD-202 Method 213, 100g for 6ms, half-sine
MIL-STD-202 Method 210, solder dip 260°C for 10s
J-STD-002
0.5
0.5
0.5
0.5
0.2
0.2
0.5
>95% coverage
Thermal Performance
Packaging
EBW5216 shunts in No Terminals style are supplied bulk packed in vacuum sealed plasꢀc bags of 100 pieces. Pressed Pin terminal
style parts are tray packed. Recommended storage condiꢀons for packed parts are: temperature 25 to 35°C, humidity 30 to 80% RH.
Ordering Procedure
Example: EBW5216PNT-L050JB (50 micro-ohms ±5%, plated, no terminals, bulk packed, Pb-free)
E
B
1
W
5
2
1
6
P
3
N
T
-
L
0
5
0
J
6
B
7
2
3
4
4
5
5
1
2
6
7
Type Size
Finish
Sense Style
Value
Tolerance Packaging
EBW 5216 P = Sn Plated NT = No Terminals L050 = 50µΩ
F = ±1% B = Bulk NT
U = Unplated PP = Pressed Pins L100 = 100µΩ H = ±3% T = Tray PP
J = ±5%
General Note
BI Technologies IRC Welwyn
TT Electronics reserves the right to make changes in product specificaꢀon without noꢀce or liability.
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All informaꢀon is subject to TT Electronics’ own data and is considered accurate at ꢀme of going to print.
04.23
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