Datasheet > DSC1033AC1

DSC1033AC1

更新时间： 2022-12-29 21:41:20

品牌	Logo	应用领域
麦瑞 - MICREL		/
页数	文件大小	规格书
7页	819K
描述
Low-Power CMOS Oscillator

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数据手册

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DSC1033AC1 数据手册

3.3V

Low-Power CMOS Oscillator

DSC1033

Board Layout (recommended)

Solder Reflow Profile

20-40

Sec

260°C

MSL 1 @ 260°C refer to JSTD-020C

Ramp-Up Rate (200°C to Peak Temp) 3°C/Sec Max.

217°C

200°C

60-150

Sec

Preheat Time 150°C to 200°C

Time maintained above 217°C

Peak Temperature

Time within 5°C of actual Peak

Ramp-Down Rate

60-180 Sec

60-150 Sec

255-260°C

20-40 Sec

6°C/Sec Max.

8 min Max.

Reflow

60-180

Sec

150°C

Cool

Pre heat

Time 25°C to Peak Temperature

25°C

Time

8 min max

Package Dimensions

7.0 x 5.0 mm Plastic Package

External Dimensions

Recommended Land Pattern*

7.0±0.10 [0.276±0.004]

5.08 [0.200]

5.08 [0.2]

2.6 [0.102]

0.2 [0.008]

3.5 [0.138]

1.4 [0.055]

2.2 [0.087]

1.4 [0.055]

0.2 [0.008]

5.0±0.10 [0.197±0.004]

0.85±0.05 [0.033±0.002]

1.4 [0.055]

1.2 [0.047]

*Note: The center pad is not connected

internally and should be left un-

connected or tied to GND.

No.

Pin Terminal

Standby#

GND

Output

VDD

units: mm [inch]

to the contents, products, programs or services described at any time without notice. This document neither states nor implies any kind of warranty, including, but not limited to

implied warranties of merchantability or fitness for a particular use.

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