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DS90LV028ATMX

更新时间： 2024-01-08 23:01:43
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
18页 1146K
描述
DS90LV028A 3V LVDS Dual CMOS Differential Line Receiver

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DS90LV028ATMX 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：SOIC
包装说明：SOP, SOP8,.25针数：8
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.39.00.01Factory Lead Time：1 week
风险等级：1.04差分输出：NO
输入特性：DIFFERENTIAL接口集成电路类型：LINE RECEIVER
接口标准：EIA-644; TIA-644JESD-30 代码：R-PDSO-G8
JESD-609代码：e3长度：4.9 mm
湿度敏感等级：1功能数量：2
端子数量：8最高工作温度：85 °C
最低工作温度：-40 °C最大输出低电流：0.002 A
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装等效代码：SOP8,.25封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：260
电源：3.3 V认证状态：Not Qualified
最大接收延迟：2.5 ns接收器位数：2
座面最大高度：1.75 mm子类别：Line Driver or Receivers
最大压摆率：9 mA最大供电电压：3.6 V
最小供电电压：3 V标称供电电压：3.3 V
电源电压1-最大：3.6 V电源电压1-分钟：3 V
电源电压1-Nom：3.3 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Matte Tin (Sn)端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：3.9 mm
Base Number Matches：1

DS90LV028ATMX 数据手册

 浏览型号DS90LV028ATMX的Datasheet PDF文件第1页浏览型号DS90LV028ATMX的Datasheet PDF文件第2页浏览型号DS90LV028ATMX的Datasheet PDF文件第4页浏览型号DS90LV028ATMX的Datasheet PDF文件第5页浏览型号DS90LV028ATMX的Datasheet PDF文件第6页浏览型号DS90LV028ATMX的Datasheet PDF文件第7页 
DS90LV028A  
www.ti.com  
SNLS013E –JUNE 1998–REVISED APRIL 2013  
Electrical Characteristics  
Over Supply Voltage and Operating Temperature ranges, unless otherwise specified.  
(1) (2)  
Symbol  
VTH  
Parameter  
Differential Input High Threshold  
Differential Input Low Threshold  
Input Current  
Conditions  
Pin  
RIN+,  
RIN  
Min  
Typ  
Max  
Units  
mV  
mV  
μA  
μA  
μA  
V
(3)  
VCM = +1.2V, 0V, 3V  
+100  
−
VTL  
−100  
−10  
−10  
-20  
IIN  
VIN = +2.8V  
VIN = 0V  
VCC = 3.6V or 0V  
VCC = 0V  
±1  
±1  
+10  
+10  
+20  
VIN = +3.6V  
VOH  
Output High Voltage  
IOH = −0.4 mA, VID = +200 mV  
IOH = −0.4 mA, Inputs terminated  
IOH = −0.4 mA, Inputs shorted  
IOL = 2 mA, VID = −200 mV  
ROUT  
2.7  
3.1  
3.1  
2.7  
V
2.7  
3.1  
V
VOL  
IOS  
Output Low Voltage  
0.3  
0.5  
V
(4)  
Output Short Circuit Current  
Input Clamp Voltage  
VOUT = 0V  
−15  
−50  
−0.8  
5.4  
−100  
mA  
V
VCL  
ICC  
ICL = −18 mA  
−1.5  
No Load Supply Current  
Inputs Open  
VCC  
9
mA  
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. All voltages are referenced to ground  
unless otherwise specified (such as VID).  
(2) All typicals are given for: VCC = +3.3V and TA = +25°C.  
(3) VCC is always higher than RIN+ and RIN− voltage. RIN+ and RIN− are allowed to have voltage range −0.05V to +3.05V. VID is not allowed  
to be greater than 100 mV when VCM = 0V or 3V.  
(4) Output short circuit current (IOS) is specified as magnitude only, minus sign indicates direction only. Only one output should be shorted  
at a time, do not exceed maximum junction temperature specification.  
Switching Characteristics  
VCC = +3.3V ± 10%, TA = −40°C to +85°C  
(1) (2)  
Symbol  
tPHLD  
tPLHD  
tSKD1  
tSKD2  
tSKD3  
tSKD4  
tTLH  
Parameter  
Conditions  
CL = 15 pF  
Min  
1.0  
1.0  
0
Typ  
1.6  
1.7  
50  
Max  
2.5  
Units  
ns  
Differential Propagation Delay High to Low  
Differential Propagation Delay Low to High  
VID = 200 mV  
2.5  
ns  
(3)  
Differential Pulse Skew |tPHLD − tPLHD  
|
(Figure 3 and Figure 4)  
400  
0.5  
ps  
(4)  
Differential Channel-to-Channel Skew-same device  
0
0.1  
ns  
(5)  
Differential Part to Part Skew  
0
1.0  
ns  
(6)  
Differential Part to Part Skew  
0
1.5  
ns  
Rise Time  
Fall Time  
325  
225  
250  
800  
800  
ps  
tTHL  
ps  
(7)  
fMAX  
Maximum Operating Frequency  
200  
MHz  
(1) CL includes probe and jig capacitance.  
(2) Generator waveform for all tests unless otherwise specified: f = 1 MHz, ZO = 50Ω, tr and tf (0% to 100%) ≤ 3 ns for RIN  
.
(3) tSKD1 is the magnitude difference in differential propagation delay time between the positive-going-edge and the negative-going-edge of  
the same channel.  
(4) tSKD2 is the differential channel-to-channel skew of any event on the same device. This specification applies to devices having multiple  
receivers within the integrated circuit.  
(5) tSKD3, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices  
at the same VCC and within 5°C of each other within the operating temperature range.  
(6) tSKD4, part to part skew, is the differential channel-to-channel skew of any event between devices. This specification applies to devices  
over the recommended operating temperature and voltage ranges, and across process distribution. tSKD4 is defined as |Max − Min|  
differential propagation delay.  
(7) fMAX generator input conditions: tr = tf < 1 ns (0% to 100%), 50% duty cycle, differential (1.05V to 1.35 peak to peak). Output criteria:  
60%/40% duty cycle, VOL (max 0.4V), VOH (min 2.7V), load = 15 pF (stray plus probes).  
Copyright © 1998–2013, Texas Instruments Incorporated  
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Product Folder Links: DS90LV028A  
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