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DS32KHZST&R PDF预览

DS32KHZST&R

更新时间： 2024-02-18 13:58:03
品牌 Logo 应用领域
美信 - MAXIM 光电二极管
页数 文件大小 规格书
8页 388K
描述
SPECIALTY ANALOG CIRCUIT, PDSO16, 0.300 INCH, SOP-16

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DS32KHZST&R 技术参数

生命周期：Active零件包装代码：SOIC
包装说明：SOP,针数：16
Reach Compliance Code：unknown风险等级：5.28
其他特性：ALSO REQUIRES 2.7V TO 5.5V BATTERY SUPPLY模拟集成电路 - 其他类型：ANALOG CIRCUIT
JESD-30 代码：R-PDSO-G16JESD-609代码：e0
长度：10.285 mm湿度敏感等级：1
功能数量：1端子数量：16
最高工作温度：70 °C最低工作温度：
封装主体材料：PLASTIC/EPOXY封装代码：SOP
封装形状：RECTANGULAR封装形式：SMALL OUTLINE
峰值回流温度（摄氏度）：245认证状态：Not Qualified
座面最大高度：2.67 mm最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：4.5 V标称供电电压 (Vsup)：5 V
表面贴装：YES温度等级：COMMERCIAL
端子面层：TIN LEAD端子形式：GULL WING
端子节距：1.27 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：7.5 mm

DS32KHZST&R 数据手册

 浏览型号DS32KHZST&R的Datasheet PDF文件第2页浏览型号DS32KHZST&R的Datasheet PDF文件第3页浏览型号DS32KHZST&R的Datasheet PDF文件第4页浏览型号DS32KHZST&R的Datasheet PDF文件第5页浏览型号DS32KHZST&R的Datasheet PDF文件第6页浏览型号DS32KHZST&R的Datasheet PDF文件第7页 
DS32kHz  
RELATED APPLICATION NOTES  
(Go to www.maxim-ic.com/RTCapps to find these application notes and more.)  
Application Note 58: Crystal Considerations with Dallas Real-Time Clocks  
Application Note 701: Using the DS32kHz with Dallas RTCs  
HANDLING, PC BOARD LAYOUT, AND ASSEMBLY  
These packages contain a quartz tuning-fork crystal. Pick-and-place equipment may be used, but precautions  
should be taken to ensure that excessive shocks are avoided. Ultrasonic cleaning should be avoided to prevent  
damage to the crystal.  
Avoid running signal traces under the package, unless a ground plane is placed between the package and the  
signal line. All N.C. (no connect) pins must be connected to ground.  
The BGA package may be reflowed as long as the peak temperature does not exceed +225°C. Peak reflow  
temperature (≥ 220°C) duration should not exceed 10 seconds, and the total time above 200°C should not exceed  
40 seconds (30 seconds nominal). For the SO package, refer to the IPC/JEDEC J-STD-020 specification for reflow  
profiles. Exposure to reflow is limited to 2 times maximum. The DIP package can be wave-soldered, provided that  
the internal crystal is not exposed to temperatures above +150°C.  
Moisture sensitive packages are shipped from the factory dry-packed. Handling instructions listed on the package  
label must be followed to prevent damage during reflow. Refer to the IPC/JEDEC J-STD-020 standard for moisture-  
sensitive device (MSD) classifications.  
THERMAL INFORMATION  
THETA-JA  
(°C/W)  
73  
THETA-JC  
(°C/W)  
23  
PACKAGE TYPE  
16-pin SO (300 mils)  
36-pin BGA  
43.9  
18.4  
PACKAGE INFORMATION  
(For the latest package information, go to www.maxim-ic.com/DallasPackInfo.)  
PACKAGE TYPE  
DOCUMENT NO.  
14-pin Encapsulated DIP  
16-pin SO (300 mils)  
36-pin BGA  
56-G0001-002  
56-G4009-001  
56-G6023-001  
Maxim cannot me responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied.  
Maxim reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical  
Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.  
8
Maxim Integrated 160 Rio Robles, San Jose, CA 95134 USA 1-408-601-1000  
©
The Maxim logo and Maxim Integrated are trademarks of Maxim Integrated Products, Inc.  
2007 Maxim Integrated  
1...5678

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