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DS3174 PDF预览

DS3174

更新时间: 2024-02-05 09:18:04
品牌 Logo 应用领域
达拉斯 - DALLAS 电信集成电路
页数 文件大小 规格书
232页 2033K
描述
Single/Dual/Triple/Quad DS3/E3 Single-Chip Transceivers

DS3174 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:BGA
包装说明:27 X 27 MM, 1.27 MM PITCH, LEAD FREE, CSBGA-400针数:400
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.82JESD-30 代码:S-PBGA-B400
JESD-609代码:e1长度:27 mm
湿度敏感等级:3功能数量:1
端子数量:400最高工作温度:70 °C
最低工作温度:封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA400,20X20,50
封装形状:SQUARE封装形式:GRID ARRAY
峰值回流温度(摄氏度):260电源:3.3 V
认证状态:Not Qualified座面最大高度:2.54 mm
子类别:Other Telecom ICs最大压摆率:0.725 mA
标称供电电压:3.3 V表面贴装:YES
电信集成电路类型:FRAMER温度等级:COMMERCIAL
端子面层:Tin/Silver/Copper (Sn/Ag/Cu)端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:27 mm
Base Number Matches:1

DS3174 数据手册

 浏览型号DS3174的Datasheet PDF文件第1页浏览型号DS3174的Datasheet PDF文件第2页浏览型号DS3174的Datasheet PDF文件第3页浏览型号DS3174的Datasheet PDF文件第5页浏览型号DS3174的Datasheet PDF文件第6页浏览型号DS3174的Datasheet PDF文件第7页 
DS3171/DS3172/DS3173/DS3174  
TABLE OF CONTENTS  
1
2
3
BLOCK DIAGRAMS  
APPLICATIONS  
FEATURE DETAILS  
3
12  
13  
3.1 GLOBAL FEATURES........................................................................................................................................ 13  
3.2 RECEIVE DS3/E3 LIU FEATURES .................................................................................................................. 13  
3.3 RECEIVE DS3/E3 FRAMER FEATURES ........................................................................................................... 13  
3.4  
TRANSMIT DS3/E3 FORMATTER FEATURES.................................................................................................... 13  
3.5 TRANSMIT DS3/E3 LIU FEATURES ................................................................................................................ 14  
3.6  
3.7  
3.8  
JITTER ATTENUATOR FEATURES..................................................................................................................... 14  
CLOCK RATE ADAPTER FEATURES ................................................................................................................. 14  
HDLC OVERHEAD CONTROLLER FEATURES................................................................................................... 14  
3.9 FEAC CONTROLLER FEATURES..................................................................................................................... 14  
3.10 TRAIL TRACE BUFFER FEATURES ................................................................................................................... 14  
3.11 BIT ERROR RATE TESTER (BERT) FEATURES ................................................................................................ 15  
3.12 LOOPBACK FEATURES ................................................................................................................................... 15  
3.13 MICROPROCESSOR INTERFACE FEATURES ..................................................................................................... 15  
3.14 TEST FEATURES............................................................................................................................................ 15  
4
5
6
STANDARDS COMPLIANCE  
ACRONYMS AND GLOSSARY  
MAJOR OPERATIONAL MODES  
16  
17  
18  
6.1 DS3/E3 SCT MODE ..................................................................................................................................... 18  
6.2 DS3/E3 CLEAR CHANNEL MODE ................................................................................................................... 20  
7
8
MAJOR LINE INTERFACE OPERATING MODES  
21  
7.1 DS3HDB3/B3ZS/AMI LIU MODE ................................................................................................................. 21  
7.2 HDB3/B3ZS/AMI NON-LIU LINE INTERFACE MODE ....................................................................................... 23  
7.3 UNI LINE INTERFACE MODE........................................................................................................................... 24  
PIN DESCRIPTIONS  
25  
8.1 SHORT PIN DESCRIPTIONS............................................................................................................................. 25  
8.2 DETAILED PIN DESCRIPTIONS......................................................................................................................... 28  
8.3 PIN FUNCTIONAL TIMING................................................................................................................................ 36  
8.3.1 Line IO.................................................................................................................................................. 36  
8.3.2 DS3/E3 Framing Overhead Functional Timing .................................................................................... 39  
8.3.3 DS3/E3 Serial Data Interface............................................................................................................... 40  
8.3.4 Microprocessor Interface Functional Timing........................................................................................ 42  
8.3.5 JTAG Functional Timing....................................................................................................................... 47  
9
INITIALIZATION AND CONFIGURATION  
48  
9.1  
MONITORING AND DEBUGGING....................................................................................................................... 49  
10 FUNCTIONAL DESCRIPTION  
50  
10.1 PROCESSOR BUS INTERFACE......................................................................................................................... 50  
10.1.1 8/16 Bit Bus Widths.............................................................................................................................. 50  
10.1.2 Ready Signal (RDY) ............................................................................................................................. 50  
10.1.3 Byte Swap Modes ................................................................................................................................ 50  
10.1.4 Read-Write / Data Strobe Modes......................................................................................................... 50  
10.1.5 Clear on Read / Clear on Write Modes................................................................................................ 50  
10.1.6 Global Write Method ............................................................................................................................ 51  
10.1.7 Interrupt and Pin Modes....................................................................................................................... 51  
10.1.8 Interrupt Structure ................................................................................................................................ 51  
10.2 CLOCKS........................................................................................................................................................ 52  
10.2.1 Line Clock Modes................................................................................................................................. 52  
4 of 230  

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