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DS15BR400_07 PDF预览

DS15BR400_07

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
美国国家半导体 - NSC 中继器
页数 文件大小 规格书
14页 316K
描述
4-Channel LVDS Buffer/Repeater with Pre-Emphasis

DS15BR400_07 数据手册

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INPUT FAILSAFE BIASING  
Application Information  
External pull up and pull down resistors may be used to pro-  
vide enough of an offset to enable an input failsafe under  
open-circuit conditions. This configuration ties the positive  
LVDS input pin to VDD thru a pull up resistor and the negative  
LVDS input pin is tied to GND by a pull down resistor. The pull  
up and pull down resistors should be in the 5kto 15krange  
to minimize loading and waveform distortion to the driver. The  
common-mode bias point ideally should be set to approxi-  
mately 1.2V. Please refer to application note AN-1194 “Fail-  
safe Biasing of LVDS Interfaces” for more information.  
INTERNAL TERMINATIONS  
The DS15BR400 has integrated termination resistors on both  
the input and outputs. The inputs have a 100resistor across  
the differential pair, placing the receiver termination as close  
as possible to the input stage of the device. The LVDS outputs  
also contain an integrated 100ohm termination resistor, this  
resistor is used to minimize the output return loss and does  
not take the place of the 100 ohm termination at the inputs to  
the receiving device. The integrated terminations improve  
signal integrity and decrease the external component count  
resulting in space savings. The DS15BR401 has 100output  
terminations only.  
DECOUPLING  
Each power or ground lead of the DS15BR400 should be  
connected to the PCB through a low inductance path. For best  
results, one or more vias are used to connect a power or  
ground pin to the nearby plane. Ideally, via placement is im-  
mediately adjacent to the pin to avoid adding trace induc-  
tance. Placing power plane closer to the top of the board  
reduces effective via length and its associated inductance.  
OUTPUT CHARACTERISTICS  
The output characteristics of the DS15BRB400/DS15BR401  
have been optimized for point-to-point backplane and cable  
applications, and are not intended for multipoint or multidrop  
signaling.  
Bypass capacitors should be placed close to VDD pins. Small  
physical size capacitors, such as 0402, X7R, surface mount  
capacitors should be used to minimize body inductance of  
capacitors. Each bypass capacitor is connected to the power  
and ground plane through vias tangent to the pads of the ca-  
pacitor. An X7R surface mount capacitor of size 0402 has  
about 0.5 nH of body inductance. At frequencies above 30  
MHz or so, X7R capacitors behave as low impedance induc-  
tors. To extend the operating frequency range to a few hun-  
dred MHz, an array of different capacitor values like 100 pF,  
1 nF, 0.03 µF, and 0.1 µF are commonly used in parallel. The  
most effective bypass capacitor can be built using sand-  
wiched layers of power and ground at a separation of 2–3  
mils. With a 2 mil FR4 dielectric, there is approximately 500  
pF per square inch of PCB.  
POWERDOWN MODE  
The PWDN input activates a hardware powerdown mode.  
When the powerdown mode is active (PWDN=L), all input and  
output buffers and internal bias circuitry are powered off.  
When exiting powerdown mode, there is a delay associated  
with turning on bandgap references and input/output buffer  
circuits as indicated in the LVDS Output Switching Charac-  
teristics  
PRE-EMPHASIS  
Pre-emphasis dramatically reduces ISI jitter from long or  
lossy transmission media. One pin is used to select the pre-  
emphasis level for all outputs, off or on. The pre-emphasis  
boost is approximately 6 dB at 750 MHz.  
The center dap of the LLP package housing the DS15BR400  
should be connected to a ground plane through an array of  
vias. The via array reduces the effective inductance to ground  
and enhances the thermal performance of the LLP package.  
Pre-emphasis Control Selection Table  
PEM  
Pre-Emphasis  
0
1
Off  
On  
www.national.com  
8

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