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DS1075M PDF预览

DS1075M

更新时间: 2024-02-29 21:49:04
品牌 Logo 应用领域
达拉斯 - DALLAS /
页数 文件大小 规格书
18页 251K
描述
Microprocessor Circuit, CMOS, PDIP8, 0.300 INCH, DIP-8

DS1075M 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:SOIC包装说明:SOP,
针数:8Reach Compliance Code:compliant
风险等级:5.65JESD-30 代码:R-PDSO-G8
JESD-609代码:e0长度:4.9 mm
湿度敏感等级:1端子数量:8
最高工作温度:70 °C最低工作温度:
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):240认证状态:Not Qualified
座面最大高度:1.75 mm最大供电电压:5.25 V
最小供电电压:4.75 V标称供电电压:5 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:TIN LEAD
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:3.9 mmuPs/uCs/外围集成电路类型:MICROPROCESSOR CIRCUIT
Base Number Matches:1

DS1075M 数据手册

 浏览型号DS1075M的Datasheet PDF文件第12页浏览型号DS1075M的Datasheet PDF文件第13页浏览型号DS1075M的Datasheet PDF文件第14页浏览型号DS1075M的Datasheet PDF文件第15页浏览型号DS1075M的Datasheet PDF文件第17页浏览型号DS1075M的Datasheet PDF文件第18页 
DS1075  
AC ELECTRICAL CHARACTERISTICS  
(TA = 0°C to 70°C, VCC = 5V + 5%)  
PARAMETER  
Output Frequency  
Tolerance  
SYMBOL  
CONDITION  
VCC = 5V, TA =  
25LC  
MIN TYP MAX UNITS NOTES  
-0.5  
0
+0.5  
%
fO  
Combined Freq.  
Variation  
Over temp and  
voltage  
-1  
+1  
%
fO  
Long Term Stability  
Maximum Input  
Frequency  
-0.5  
+0.5  
50  
25  
%
fO  
fOSCIN  
fOUT  
External clock  
Crystal reference  
MHz  
MHz  
kHz  
1
2
Minimum Output  
Frequency  
Power-Up Time  
Enable OUT from PDN  
Enable OUT0 from  
PDN ↑  
29.3  
tpor + tstab  
tstab  
0.1  
0.1  
0.1  
1
1
1
ms  
ms  
ms  
3, 4  
4
4, 5  
tstab  
tpdn  
tpdn  
CL  
1
1
ms  
ms  
pF  
OUT Hi-Z from PDN ↓  
OUT0 Hi-Z from PDN ↓  
Load Capacitance  
(IN/OUT, OUT0)  
Output Duty Cycle  
IN/OUT, OUT0  
Jitter  
15  
6
7
40  
40  
60  
60  
100  
%
%
pS  
J
NOTES:  
1. This is the maximum frequency which can be applied to OSCIN, or, the maximum crystal frequency  
that can be used.  
2. The values of M, N and the frequency of OSCIN (if used) must be chosen so that this spec is met.  
3. This is the time from when VCC is applied until the output starts oscillating.  
4. When the device is initially powered up, or restored from the power-down mode, OE should be  
asserted (high). Otherwise the start of the tstab interval will be delayed until OE goes high. OE can  
subsequently be returned to a low level during the tstab interval to force out low after the tstab interval.  
If the external mode is selected tstab will be a function of the OSCIN period, i.e., external clock  
frequency. See “Calculated Parameters” to determine the value of tstab in this case.  
5. Although OE does not normally affect OUT0 operation, if OE is held low during power-up the start of  
the tstab period will be delayed until OE is asserted. If OE remains low, OUT0 will not start.  
6. Operation with higher capacitive loads is possible but may impair output voltage swing and maximum  
operation frequency.  
7. Parameter given is a typical max.  
16 of 18  

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