DMTH4014SPSW
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
40
Unit
V
Gate-Source Voltage
±20
43.5
30.8
43.5
170
170
19.7
19.4
V
VGSS
TC = +25°C
Continuous Drain Current (Note 6)
A
ID
TC = +100°C
Maximum Continuous Body Diode Forward Current (Note 6)
Pulsed Drain Current (10µs Pulse, Duty Cycle = 1%)
Pulsed Body Diode Forward Current (10μs Pulse, Duty Cycle = 1%)
Avalanche Current, L=0.1mH
A
A
IS
IDM
A
I
SM
A
IAS
Avalanche Energy, L=0.1mH
mJ
EAS
Thermal Characteristics
Characteristic
Total Power Dissipation (Note 5)
Symbol
PD
Value
4
38
Unit
W
TA = +25°C
Steady State
TC = +25°C
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
°C/W
W
RθJA
46.9
PD
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
3.2
°C/W
°C
RθJC
-55 to +175
TJ, TSTG
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
40
—
—
—
—
—
—
1
V
BVDSS
IDSS
VGS = 0V, ID = 1mA
VDS = 32V, VGS = 0V
μA
nA
±100
IGSS
VGS = ±20V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
2
—
11.4
0.9
4
V
mΩ
V
VGS(TH)
RDS(ON)
VSD
VDS = VGS, ID = 250μA
VGS = 10V, ID = 20A
VGS = 0V, IS = 20A
Static Drain-Source On-Resistance
Diode Forward Voltage
—
—
14.8
1.2
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
805
208
15
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Ciss
Coss
Crss
Rg
VDS = 20V, VGS = 0V,
f = 1MHz
Output Capacitance
pF
Ω
Reverse Transfer Capacitance
Gate Resistance
1.2
10.6
2.2
2.7
4.1
3.8
8.6
1.9
10.2
9.6
VDS = 0V, VGS = 0V, f = 1MHz
VDD = 20V, ID = 20A, VGS = 10V
Total Gate Charge
Qg
Gate-Source Charge
nC
Qgs
Qgd
tD(ON)
tR
Gate-Drain Charge
Turn-On Delay Time
Turn-On Rise Time
VGS = 20V, VDS = 10V,
Rg = 1.6Ω, ID = 20A
ns
Turn-Off Delay Time
tD(OFF)
tF
Turn-Off Fall Time
Body Diode Reverse Recovery Time
ns
tRR
IF = 15A, di/dt = 400A/μs
Body Diode Reverse Recovery Charge
nC
QRR
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with thermal bias to bottom layer 1inch square copper plate.
6. Thermal resistance from junction to soldering point (on the exposed drain pad).
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
2 of 7
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January 2021
© Diodes Incorporated
DMTH4014SPSW
Document number: DS42889 Rev. 2 - 2