DMT10H025LK3
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Drain-Source Voltage
Symbol
VDSS
Value
Unit
V
100
±20
Gate-Source Voltage
V
VGSS
TC = +25°C
TC = +70°C
47.2
37.7
A
Continuous Drain Current, VGS = 10V
ID
185
185
2.6
A
A
Pulsed Drain Current (10µs Pulse, TC = +25°C, Package Limited)
IDM
ISM
IS
Pulsed Body Diode Forward Current (10µs Pulse, TC = +25°C, Package Limited)
Maximum Continuous Body Diode Forward Current (Note 6)
Avalanche Current, L = 0.1mH
A
15.8
12.5
A
IAS
EAS
Avalanche Energy, L = 0.1mH
mJ
Thermal Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
PD
Value
Unit
W
Total Power Dissipation (Note 5)
2.6
Steady State
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
48
83
°C/W
W
RθJA
PD
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
1.5
°C/W
°C
RθJC
-55 to +150
TJ, TSTG
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Source Leakage
Symbol
Min
Typ
Max
Unit
Test Condition
100
—
—
—
—
—
1
V
BVDSS
IDSS
VGS = 0V, ID = 1mA
VDS = 80V, VGS = 0V
VGS = ±20V, VDS = 0V
µA
nA
—
±100
IGSS
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
1
—
3
22
V
mΩ
V
VGS(TH)
RDS(ON)
VSD
VDS = VGS, ID = 250µA
VGS = 10V, ID = 20A
VGS = 6V, ID = 20A
VGS = 4.5V, ID = 20A
VGS = 0V, IS = 20A
—
—
—
—
17.1
21.4
28.3
—
Static Drain-Source On-Resistance
30
43.7
1.3
Diode Forward Voltage
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
—
—
—
—
—
—
—
—
—
—
—
—
—
1477
263
20
—
—
—
—
—
—
—
—
—
—
—
—
—
Ciss
Coss
Crss
RG
VDS = 50V, VGS = 0V
f = 1MHz
Output Capacitance
pF
Ω
Reverse Transfer Capacitance
Gate Resistance
1.3
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge
21
5.7
QG
VDD = 50V, ID = 20A,
VGS = 10V
Gate-Source Charge
Gate-Drain Charge
nC
QGS
QGD
tD(ON)
tR
3.8
6.3
Turn-On Delay Time
Turn-On Rise Time
9.4
16.7
8.2
38.7
53.7
VDD = 50V, VGS = 10V,
ID = 20A, RG = 6Ω
ns
Turn-Off Delay Time
Turn-Off Fall Time
tD(OFF)
tF
Reverse Recovery Time
Reverse Recovery Charge
ns
tRR
IF = 20A, di/dt = 100A/µs
nC
QRR
Notes:
5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1-inch square copper plate.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to product testing.
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July 2018
© Diodes Incorporated
DMT10H025LK3
Document number: DS40039 Rev. 3 - 2