DLP3010
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ZHCSHW7B –FEBRUARY 2018 –REVISED MAY 2022
Table of Contents
7.5 Optical Interface and System Image Quality
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
6 Specifications.................................................................. 6
6.1 Absolute Maximum Ratings ....................................... 6
6.2 Storage Conditions..................................................... 7
6.3 ESD Ratings............................................................... 7
6.4 Recommended Operating Conditions.........................7
6.5 Thermal Information..................................................10
6.6 Electrical Characteristics...........................................10
6.7 Timing Requirements................................................ 11
6.8 Switching Characteristics..........................................16
6.9 System Mounting Interface Loads............................ 16
6.10 Micromirror Array Physical Characteristics.............17
6.11 Micromirror Array Optical Characteristics............... 18
6.12 Window Characteristics.......................................... 19
6.13 Chipset Component Usage Specification............... 20
7 Detailed Description......................................................21
7.1 Overview...................................................................21
7.2 Functional Block Diagram.........................................21
7.3 Feature Description...................................................22
7.4 Device Functional Modes..........................................22
Considerations............................................................ 22
7.6 Micromirror Array Temperature Calculation.............. 23
7.7 Micromirror Landed-On/Landed-Off Duty Cycle....... 24
8 Application and Implementation..................................28
8.1 Application Information............................................. 28
8.2 Typical Application.................................................... 28
9 Power Supply Recommendations................................31
9.1 Power Supply Power-Up Procedure......................... 31
9.2 Power Supply Power-Down Procedure.....................31
9.3 Power Supply Sequencing Requirements................ 32
10 Layout...........................................................................34
10.1 Layout Guidelines................................................... 34
10.2 Layout Example...................................................... 34
11 Device and Documentation Support..........................35
11.1 Device Support........................................................35
11.2 Related Links.......................................................... 35
11.3 接收文档更新通知................................................... 35
11.4 支持资源..................................................................36
11.5 Trademarks............................................................. 36
11.6 Electrostatic Discharge Caution..............................36
11.7 术语表..................................................................... 36
12 Mechanical, Packaging, and Orderable
Information.................................................................... 36
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision A (October 2021) to Revision B (May 2022)
Page
• Updated Absolute Maximum Ratings disclosure to the latest TI standard......................................................... 6
• Updated Micromirror Array Optical Characteristics ......................................................................................... 18
• Added Third-Party Products Disclaimer ...........................................................................................................35
Changes from Revision * (February 2018) to Revision A (October 2021)
Page
• 更新了整个文档中的表、图和交叉参考的编号格式.............................................................................................1
• Updated |TDELTA| MAX from 30°C to 15°C..........................................................................................................7
Copyright © 2022 Texas Instruments Incorporated
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