DE475-102N21A
RFꢀPowerꢀMOSFETꢀ
♦ꢁ NꢁChannelꢀEnhancementꢀModeꢀ
♦ꢁ LowꢀQgꢀandꢀRgꢀ
VDSS
ꢀ
=ꢀ 1000ꢀVꢀ
♦ꢁ Highꢀdv/dtꢀ
♦ꢁ NanosecondꢀSwitchingꢀ
♦ꢁ 30MHzꢀMaximumꢀFrequencyꢀ
ID25ꢀ
=ꢀ
24ꢀAꢀ
RDS(on)ꢀ ≤ꢀ
0.45ꢀꢀꢀ
Symbolꢀ
VDSS
VDGR
VGS
VGSM
ID25
IDM
ARꢀ
TestꢀConditionsꢀ
TJꢀ=ꢀ25°Cꢀtoꢀ150°Cꢀꢀ
TJꢀ=ꢀ25°Cꢀtoꢀ150°C;ꢀRGSꢀ=ꢀ1ꢀMꢀꢀꢀ
Continuousꢀ
MaximumꢀRatingsꢀꢀ
ꢀ
1000ꢀ
1000ꢀ
±20ꢀ
Vꢀ
V
PDCꢀ
=ꢀ 1800Wꢀ
ꢀ
ꢀ
Vꢀ
Transientꢀ
ꢀ
±30ꢀ
24ꢀ
Vꢀ
Aꢀ
Tcꢀ=ꢀ25°Cꢀꢀ
ꢀ
Tcꢀ=ꢀ25°C,ꢀpulseꢀwidthꢀlimitedꢀbyꢀTJMꢀꢀ
Tcꢀ=ꢀ25°Cꢀꢀ
ꢀ
144ꢀ
21ꢀ
Aꢀ
I
Aꢀ
Tcꢀ=ꢀ25°Cꢀꢀ
EAR
ꢀ
ꢀ
30ꢀ
mJꢀ
ISꢀ≤ꢁIDM,ꢀdi/dtꢀ≤ꢁꢀ100A/ꢂs,ꢀVDDꢀ≤ꢀVDSS,ꢀꢀ
Tjꢀ≤ꢀ150°C,ꢀRGꢀ=ꢀ0.2ꢀꢀꢀ
5ꢀ V/nsꢀ
dv/dtꢀꢀ
ISꢀ=ꢀ0ꢀ
ꢀ
>200ꢀ V/nsꢀ
PDC
ꢀ
1800ꢀ
730ꢀ
Wꢀ
Wꢀ
DRAIN
Tcꢀ=ꢀ25°Cꢀ
Derateꢀ4.0W/°Cꢀaboveꢀ25°Cꢀ
PDHS
ꢀ
GATE
Tcꢀ=ꢀ25°Cꢀꢀ
PDAMB
ꢀ
4.5ꢀ
Wꢀ
ꢀ
ꢀ
RthJC
ꢀ
0.08ꢀ C/Wꢀ
0.20ꢀ C/Wꢀ
SG1 SG2
SD1
SD2
RthJHS
ꢀ
Featuresꢀ
•ꢁ IsolatedꢀSubstrateꢀ
Symbolꢀ
TestꢀConditions
CharacteristicꢀValuesꢀ
TJꢀ=ꢀ25°Cꢀunlessꢀotherwiseꢀspecifiedꢀꢀ
−ꢁ highꢀisolationꢀvoltageꢀ(>2500V)ꢀ
−ꢁ excellentꢀthermalꢀtransferꢀ
ꢀ
ꢀ
min.ꢀ
1000ꢀ
3.5ꢀ
typ.ꢀ
max.ꢀ ꢀ
−ꢁ Increasedꢀtemperatureꢀandꢀpowerꢀ
VGSꢀ=ꢀ0ꢀV,ꢀIDꢀ=ꢀ3ꢀmaꢀ
VDSꢀ=ꢀVGS,ꢀIDꢀ=ꢀ4ꢀmaꢀ
VGSꢀ=ꢀ±20ꢀVDC,ꢀVDSꢀ=ꢀ0ꢀ
VDSS
VGS(th)
IGSS
IDSS
ꢀ
ꢀ
ꢀ
Vꢀ
Vꢀ
cyclingꢀcapabilityꢀꢀꢀ
•ꢁ IXYSꢀadvancedꢀlowꢀQgꢀprocessꢀ
•ꢁ Lowꢀgateꢀchargeꢀandꢀcapacitancesꢀ
−ꢁ easierꢀtoꢀdriveꢀ
ꢀ
4.4ꢀ
5.5ꢀ
ꢀ
ꢀ
ꢀ
ꢀ
±100ꢀ nAꢀ
−ꢁ fasterꢀswitchingꢀ
VDSꢀ=ꢀ0.8ꢀVDSSꢀTJꢀ=ꢀ25°Cꢀꢀ
VGSꢀ=ꢀ0ꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀꢀTJꢀ=ꢀ125°Cꢀꢀ
ꢀ
ꢀ
50ꢀ
1ꢀ
ꢂAꢀ
mAꢀ
•ꢁ LowꢀRDS(on)
ꢀ
•ꢁ Veryꢀlowꢀinsertionꢀinductanceꢀ(<2nH)ꢀ
VGSꢀ=ꢀ15ꢀV,ꢀIDꢀ=ꢀ0.5ID25
Pulseꢀtest,ꢀtꢀ≤ꢀ300ꢂS,ꢀdutyꢀcycleꢀdꢀ≤ꢀ2%ꢀꢀ
ꢀ
RDS(on)
ꢀ
ꢀ
0.45ꢀ
ꢀꢀ
•ꢁ Noꢀberylliumꢀoxideꢀ(BeO)ꢀorꢀotherꢀhazꢁ
ardousꢀmaterialsꢀꢀ
ꢀ
VDSꢀ=ꢀ15ꢀV,ꢀIDꢀ=ꢀ0.5ID25,ꢀpulseꢀtestꢀ
gfsꢀ
TJꢀ
ꢀ
12ꢀ
ꢀ
ꢀ
Sꢀ
Advantagesꢀ
ꢀ
ꢁ55ꢀ
+175ꢀ °Cꢀꢀꢀ
•ꢁ OptimizedꢀforꢀRFꢀandꢀhighꢀspeedꢀ
switchingꢀatꢀfrequenciesꢀtoꢀ30MHzꢀ
ꢀ
TJM
Tstg
TLꢀ
ꢀ
ꢀ
ꢀ
175ꢀ
ꢀ
ꢀ
°Cꢀꢀꢀꢀ
•ꢁ Easyꢀtoꢀmount—noꢀinsulatorsꢀneededꢀ
•ꢁ Highꢀpowerꢀdensityꢀ
ꢀ
ꢁ55ꢀ
+175ꢀ °Cꢀꢀꢀꢀꢀ
ꢀ
1.6mmꢀ(0.063ꢀin)ꢀfromꢀcaseꢀforꢀ10ꢀsꢀꢀ
ꢀ
ꢀ
ꢀ
300ꢀ
3ꢀ
ꢀ
ꢀ
°Cꢀꢀꢀꢀꢀꢀ
gꢀ
Weightꢀ