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DAC7545KU PDF预览

DAC7545KU

更新时间： 2024-01-20 10:11:19
品牌 Logo 应用领域
BB 转换器数模转换器微处理器光电二极管
页数 文件大小 规格书
12页 383K
描述
CMOS 12-Bit Multiplying DIGITAL-TO-ANALOG CONVERTER Microprocessor Compatible

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DAC7545KU 技术参数

是否Rohs认证：不符合生命周期：Obsolete
Reach Compliance Code：unknown风险等级：5.75
Is Samacsys：N转换器类型：D/A CONVERTER
输入位码：BINARY, OFFSET BINARY输入格式：PARALLEL, WORD
JESD-30 代码：R-CDIP-T20JESD-609代码：e0
最大线性误差 (EL)：0.0488%位数：12
功能数量：1端子数量：20
最高工作温度：125 °C最低工作温度：-55 °C
封装主体材料：CERAMIC, METAL-SEALED COFIRED封装代码：DIP
封装等效代码：DIP20,.3封装形状：RECTANGULAR
封装形式：IN-LINE电源：5/15 V
认证状态：Not Qualified最大稳定时间：2 µs
子类别：Other Converters最大压摆率：2 mA
标称供电电压：15 V表面贴装：NO
技术：CMOS温度等级：MILITARY
端子面层：Tin/Lead (Sn/Pb)端子形式：THROUGH-HOLE
端子节距：2.54 mm端子位置：DUAL
Base Number Matches：1

DAC7545KU 数据手册

 浏览型号DAC7545KU的Datasheet PDF文件第4页浏览型号DAC7545KU的Datasheet PDF文件第5页浏览型号DAC7545KU的Datasheet PDF文件第6页浏览型号DAC7545KU的Datasheet PDF文件第8页浏览型号DAC7545KU的Datasheet PDF文件第9页浏览型号DAC7545KU的Datasheet PDF文件第10页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Top-Side Markings  
Samples  
Drawing  
ZZ222  
DW  
Qty  
(1)  
(2)  
(3)  
(4)  
DAC7545GLP  
DAC7545GLU  
OBSOLETE  
NRND  
ZZ (BB)  
SOIC  
20  
20  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
DAC7545GLU  
DAC7545GLUG4  
NRND  
SOIC  
DW  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 85  
DAC7545GLU  
DAC7545JP  
DAC7545JU  
OBSOLETE  
NRND  
ZZ (BB)  
SOIC  
ZZ222  
DW  
20  
20  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
DAC7545JU  
DAC7545JU  
DAC7545JUG4  
NRND  
SOIC  
DW  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 85  
DAC7545KP  
DAC7545KU  
OBSOLETE  
NRND  
ZZ (BB)  
SOIC  
ZZ222  
DW  
20  
20  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
DAC7545KU  
DAC7545KU  
DAC7545KUG4  
NRND  
SOIC  
DW  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 85  
DAC7545LP  
DAC7545LU  
OBSOLETE  
NRND  
ZZ (BB)  
SOIC  
ZZ222  
DW  
20  
20  
TBD  
Call TI  
Call TI  
-40 to 85  
-40 to 85  
25  
25  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
DAC7545LU  
DAC7545LU  
DAC7545LUG4  
NRND  
SOIC  
DW  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-3-260C-168 HR  
-40 to 85  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Addendum-Page 1  
1...45678910...12

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