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DAC1210 PDF预览

DAC1210

更新时间: 2024-02-02 09:58:53
品牌 Logo 应用领域
美国国家半导体 - NSC 转换器模数转换器
页数 文件大小 规格书
18页 362K
描述
12-Bit, uP Compatible, Double-Buffered D to A Converters

DAC1210 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
包装说明:DIP, DIP24,.6Reach Compliance Code:unknown
风险等级:5.92转换器类型:D/A CONVERTER
输入位码:OFFSET BINARY, COMPLEMENTARY OFFSET BINARYJESD-30 代码:R-XDIP-T24
JESD-609代码:e0最大线性误差 (EL):0.05%
位数:12功能数量:1
端子数量:24最高工作温度:85 °C
最低工作温度:-40 °C封装主体材料:CERAMIC
封装代码:DIP封装等效代码:DIP24,.6
封装形状:RECTANGULAR封装形式:IN-LINE
电源:12/15 V子类别:Other Converters
表面贴装:NO技术:CMOS
温度等级:INDUSTRIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:THROUGH-HOLE端子节距:2.54 mm
端子位置:DUALBase Number Matches:1

DAC1210 数据手册

 浏览型号DAC1210的Datasheet PDF文件第6页浏览型号DAC1210的Datasheet PDF文件第7页浏览型号DAC1210的Datasheet PDF文件第8页浏览型号DAC1210的Datasheet PDF文件第10页浏览型号DAC1210的Datasheet PDF文件第11页浏览型号DAC1210的Datasheet PDF文件第12页 
Application Hints (Continued)  
cations where the DAC is used in a continuous feedback  
control loop and is driven by a binary up/down counter, or in  
function generation circuits where a ROM is continuously  
providing DAC data.  
incrementing the address for Byte 2) from propagating  
through the address word and changing any of the bits de-  
coded for CS or XFER. Figure 5 shows how to prevent this  
effect.  
Only the DAC1208, DAC1209, DAC1210 devices can have  
all 12 inputs flow-through. Simply grounding CS, WR1, WR2  
and XFER and tying Byte 1/Byte 2 high allows both internal  
registers to follow the applied digital inputs (flow-through)  
and directly affect the DAC analog output.  
The same problem can occur from a borrow when an auto-  
decremented address is used; but only if the processor’s  
address outputs are inverted before being decoded.  
1.8 Control Signal Timing  
When interfacing these MICRO-DACs to any microproces-  
sor, there are two important time relationships that must be  
considered to insure proper operation. The first is the mini-  
mum WR strobe pulse width which is specified as 320 ns for  
1.7 Address Decoding Tips  
It is possible to map the MICRO-DACs into system ROM  
space to allow more efficient use of existing address decod-  
ing hardware. The DAC in effect can share the same ad-  
dresses of any number of ROM locations. The ROM outputs  
will only be enabled by a READ of its address (gated by the  
system READ strobe) and the DAC will only accept data  
that is written to the same address (gated by the system  
WRITE strobe).  
e
V
11.4V to 15.75V and operation over temperature, but  
CC  
typically a pulse width of only 250 ns is adequate. A second  
consideration is that the guaranteed minimum data hold  
time of 90 ns should be met or erroneous data can be  
latched. This hold time is defined as the length of time data  
must be held valid on the digital inputs after a qualified (via  
CS) WR strobe makes a low to high transition to latch the  
applied data.  
The Byte 1/Byte 2 control function can easily be generated  
by the processor’s least significant address bit (A0) by plac-  
ing the DAC at two consecutive address locations and utiliz-  
ing double-byte WRITE instructions which automatically in-  
crement or decrement the address. The CS and XFER sig-  
nals can then be decoded from the remaining address bits.  
Care must be taken in selecting the actual address used  
for Byte 1 of the DAC to prevent a carry (as a result of  
If the controlling device or system does not inherently meet  
these timing specs the DAC can be treated as a slow mem-  
ory or peripheral and utilize a technique to extend the write  
strobe. A simple extension of the write time, by adding a  
wait state, can simultaneously hold the write strobe active  
and data valid on the bus to satisfy the minimum WR pulse  
Write  
Address Bits  
Cycle  
15  
2
1*  
0
0**  
1
First  
X
ä
Y
(Byte 1)  
Decoded to  
Address DAC  
Second  
(Byte 2)  
1
0
*Starting with a 0 prevents a carry on address incrementing.  
**Used as Byte 1/Byte2 Control.  
FIGURE 5  
TL/H/5690-12  
FIGURE 6. Accommodating a High Speed System  
9

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