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DAC-1212SE PDF预览

DAC-1212SE

更新时间: 2022-02-26 11:13:06
品牌 Logo 应用领域
达特尔 - DATEL /
页数 文件大小 规格书
7页 525K
描述
12-Bit, 125MSPS, Low-Power D/A Converters

DAC-1212SE 数据手册

 浏览型号DAC-1212SE的Datasheet PDF文件第1页浏览型号DAC-1212SE的Datasheet PDF文件第2页浏览型号DAC-1212SE的Datasheet PDF文件第3页浏览型号DAC-1212SE的Datasheet PDF文件第5页浏览型号DAC-1212SE的Datasheet PDF文件第6页浏览型号DAC-1212SE的Datasheet PDF文件第7页 
DAC-1212  
12-Bit, 125MSPS, Low-Power D/A Converters  
Ground Planes  
Board Assembly Considerations  
Precision converters provide high accuracyover temperature extremes, but some PC board  
assemblyprecautions are necessary. Changes in DC parameters can be expected with Pb-free  
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reduce device initial accuracy.  
If separate DGND and AGND planes are used, then all of the digital functions of the device and  
the corresponding components should be located over the DGND plane and terminated to the  
DGND plane.The same is true for the analog components and the AGND. Ifproper grounding  
practices are implemented the converter will function properly with a single common ground  
plane.  
PIN DESCRIPTIONS  
Supply Bypassing  
PIN  
PIN NAME  
BIT 1(MSB)  
DESCRIPTION  
To minimize power supply noise, 0.1uF capacitors should be placed as close as possible to the  
converter’s power supply pins, AVDD and DVDD. Be assured that capacitors are bypassed to their  
proper AGND or DGND planes.  
1 -12 through B12 (LSB) Digital Data input bits. B1 (MSB), B12 (LSB).  
13-14  
NC  
No Connection. For noise rejection may be tied to AGND.  
Control pin to power-down the DAC. Sleep = HI, On =  
Humidity Susceptibility  
15  
SHTDWN  
REFSEL  
REFI/O  
LO. Internal 20µA active pull-down current.  
Plastic mold compounds that are used to house ICs can absorb moisture.When these devices are  
exposedto humiditythe plastic package can undergo slight changes that can applypressure  
to the internal die. Stresses placedon a precision data converters can cause changes in its  
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humidity is a concern.  
Connect to AGND to enable internal 1.2V reference. Con-  
16  
nect to AVDD to disable internal reference.  
Reference voltage output when using internal 1.2V refer-  
ence Input pin when supplying external reference.  
Full Scale current adjustment (gain). Use resistor to AGND  
to set current  
17  
18  
19  
20  
GAINADJ  
COMP  
AGND  
(see technical notes).  
External capacitor to AGND helps to reduce bandwidth.  
Board Mounting Considerations  
Analog Ground  
Complimentary output current. Full scale is attained when  
digital inputs are at all 0's.  
For applications requiring the highest accuracy, attention should be paid to the board mounting  
location of SE and SM devices.These models use a plasticTSSOP package that could subject  
the die to mild stresses when the printed circuit board is cooled or heated. Placing the device  
in areas subject toslight twisting maycause die stresses and consequently degradation in  
the accuracy of the converter. It is preferred that the device be placedin the center of the PCB  
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for -QL and /883 devices eliminates the potential for die stress.  
21  
IOUTB  
True output current. Full scale is attained when digital  
inputs are at all 1's.  
22  
23  
24  
25  
26  
27  
IOUTA  
NC  
AVDD  
AGND  
DGND  
DVDD  
Do notconnect. Internal resistive connection to AGND.  
Supply for analog circuitry (typically +3V to +5V).  
Analog Ground  
Digital Ground  
Supply for digital circuitry (typically +3V to +5V).  
Rising edge of clock latchesdata into input registers  
thereby updating converter.  
28  
CLK  
GLOSSARY OF SPECIFICATIONS  
DIFFERENTIAL LINEARITY ERROR:The maximum deviation of anyquantum (LSB change) in the transfer function of a data converter from itsideal size of FSR/2n.  
DIFFERENTIAL LINEARITY TEMPCO:5IFꢀDIBOHFꢀJOꢀEJ ꢀFSFOUJBMꢀMJOFBSJUZꢀFSSPSꢀXJUIꢀUFNQFSBUVSFꢀGPSꢀBꢀEBUBꢀDPOWFSUFSꢈꢀFYQSFTTFEꢀJOꢀQQNꢆ¡$ꢀPGꢀ'43ꢀꢉ'VMMꢀ4DBMFꢀ3BOHFꢊꢌ  
GAIN ERROR:5IFꢀEJ ꢀFSFODFꢀJOꢀTMPQFꢀCFUXFFOꢀUIFꢀBDUVBMꢀBOEꢀJEFBMꢀUSBOTGFSꢀGVODUJPOTꢀGPSꢀBꢀEBUBꢀDPOWFSUFSꢀPSꢀPUIFSꢀDJSDVJUꢌꢀ*UꢀJTꢀFYQSFTTFEꢀBTꢀBꢀQFSDFOUꢀPGꢀBOBMPHꢀNBHOJUVEFꢌ  
GAIN TEMPCO:The change in gain (or scale factor) with temperature for a data converter or other circuit, generally expressedin ppm/°C.  
INTEGRAL LINEARITY ERROR:ꢀ5IFꢀNBYJNVNꢀEFWJBUJPOꢀPGꢀBꢀEBUBꢀDPOWFSUFSꢀUSBOTGFSꢀGVODUJPOꢀGSPNꢀUIFꢀJEFBMꢀTUSBJHIUꢀMJOFꢀXJUIꢀP ꢀTFUꢀBOEꢀHBJOꢀFSSPSTꢀ[FSPFEꢌꢀ*UꢀJTꢀHFOFSBMMZꢀFYQSFTTFEꢀJOꢀ-4#hTꢀPSꢀJOꢀ  
percent of FSR.  
INTERNAL REFERENCE VOLTAGE DRIFT:The maximum deviation from the measured value at room temperature as compared with the value measured at eitherTmin orTmax.  
OUTPUT COMPLIANCE RANGE:The allowable MaximumVoltage at the output of a D/A.  
OFFSET ERROR:The deviation from the ideal at analog zero output  
OFFSET DRIFT: The change with temperature ofanalog zero for a data converter operating in the bipolar mode. Itis generally expressed in ppm/°C of FSR.  
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supply change.  
REFERENCE INPUT MULTIPLYING BANDWIDTH: The -3dB reduction in the output when applying a sinusoidal voltage to the external reference (digital inputs are set to all 1s).The frequency is  
increaseduntil the amplitude of the output waveform is -3dB of its original value.  
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TOTAL HARMONIC DISTORTION:ꢁ5IFꢁSBUJPꢁPGꢁUIFꢁSNTꢁꢁTVNꢁPGꢁUIFꢁ ꢁSTUꢁꢅꢁIBSNPOJDTꢁUPꢁUIFꢁSNTꢁPGꢁUIFꢁGVOEBNFOUBMꢁTJHOBMꢂꢁVTVBMMZꢁFYQSFTTFEꢁJOꢁE#  
GLITCH AREA: The transientappearing at the output when the input switches from one code to another.Typically the worst case is found atthe MSB code transition. It is measured as the area  
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SPURIOUS FREE DYNAMIC RANGE (SFDR): The largest harmonic, spurious frequency or noise component in a signal FFT. It is expressed in db with respect to the fundamental frequency.  
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30 October 2015 MDA_DAC-1212.C01.D1 Page4 of 7  

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