µPD78001B(A), 78002B(A)
CONTENTS
1. PIN CONFIGURATION (TOP VIEW).....................................................................................................
2. BLOCK DIAGRAM...................................................................................................................................
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9
3. PIN FUNCTIONS ..................................................................................................................................... 10
3.1 PORT PINS ...................................................................................................................................................... 10
3.2 OTHER PINS ................................................................................................................................................... 12
3.3 PIN I/O CIRCUIT AND RECOMMENDED CONNECTION OF UNUSED PINS ...................................... 13
4. MEMORY SPACE.................................................................................................................................... 15
5. PERIPHERAL HARDWARE FUNCTION FEATURES............................................................................ 16
5.1 PORTS .............................................................................................................................................................. 16
5.2 CLOCK GENERATOR...................................................................................................................................... 17
5.3 TIMER/EVENT COUNTER.............................................................................................................................. 18
5.4 CLOCK OUTPUT CONTROL CIRCUIT ......................................................................................................... 20
5.5 BUZZER OUTPUT CONTROL CIRCUIT ....................................................................................................... 20
5.6 SERIAL INTERFACES ..................................................................................................................................... 21
6. INTERRUPT FUNCTIONS AND TEST FUNCTIONS .......................................................................... 22
6.1 INTERRUPT FUNCTIONS............................................................................................................................... 22
6.2 TEST FUNCTIONS.......................................................................................................................................... 25
7. EXTERNAL DEVICE EXPANSION FUNCTIONS ................................................................................. 26
8. STANDBY FUNCTIONS ......................................................................................................................... 26
9. RESET FUNCTION .................................................................................................................................. 26
10. INSTRUCTION SET ................................................................................................................................ 27
11. ELECTRICAL SPECIFICATIONS ............................................................................................................. 30
12. CHARACTERISTIC CURVE (REFERENCE VALUES) ........................................................................... 48
13. PACKAGE DRAWINGS........................................................................................................................... 52
14. RECOMMENDED SOLDERING CONDITIONS ..................................................................................... 56
APPENDIX A. DEVELOPMENT TOOLS ...................................................................................................... 57
APPENDIX B. RELATED DOCUMENTS ...................................................................................................... 59
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