www.eicsemi.com
SILICON BRIDGE RECTIFIERS
D20XB20 - D20XB60
RBV25
PRV : 200 - 600 Volts
Io : 20 Amperes
3.9 ± 0.2
30 ± 0.3
C3
4.9 ± 0.2
Φ
3.2 ± 0.1
FEATURES :
* High current capability
* High surge current capability
* High reliability
+
* Low reverse current
* Low forward voltage drop
* High case dielectric strength of 2000 VAC @1 Sec
~ ~
* Ideal for printed circuit board
* Very good heat dissipation
* Pb / RoHS Free
1.0 ± 0.1
7.5
±0.2 ±0.2
7.5
10
MECHANICAL DATA :
2.0 ± 0.2
0.7 ±0.1
±0.2
* Case : Reliable low cost construction
utilizing molded plastic technique
* Epoxy : UL94V-0 rate flame retardant
* Terminals : Plated lead solderable per
MIL-STD-202, Method 208 guaranteed
* Polarity : Polarity symbols marked on case
* Mounting position : Any
Dimensions in millimeters
* Weight : 7.7 grams
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Rating at 25°C ambient temperature unless otherwise specified.
RATING
SYMBOL
D20XB20
D20XB60
UNIT
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
V
RRM
RMS
DC
200
140
200
600
420
600
V
V
V
V
Maximum DC Blocking Voltage
V
Maximum Average Forward Current
(50Hz Sine wave, R-load)
20 (With heatsink, Tc = 87°C)
3.5 (Without heatsink, Ta = 25°C)
I
O
A
Maximum Peak Forward Surge Current, Tj = 25°C
(50Hz sine wave, Non-repetitive 1 cycle peak value)
I
FSM
240
A
I2t
A2S
V
200
1.1
Current Squared Time at 1ms ≤ t < 10 ms, Tc=25°C
Maximum Forward Voltage per Diode at I
Maximum DC Reverse Current, V
( Pulse measurement, Rating of per diode)
F
= 10 A
VF
R
=VRRM
I
R
10
μA
Maximum Thermal Resistance, Junction to case
Maximum Thermal Resistance, Junction to Ambient
Operating Junction Temperature
1.5 (With heatsink)
22 (Without heatsink)
150
°C/W
°C/W
°C
R
θ
JC
JA
R
θ
T
J
Storage Temperature Range
TSTG
- 40 to + 150
°C
Page 1 of 2
Rev. 03 : August 20, 2012