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CY7C1668KV18-450BZXC PDF预览

CY7C1668KV18-450BZXC

更新时间: 2024-01-02 00:34:07
品牌 Logo 应用领域
赛普拉斯 - CYPRESS 双倍数据速率静态存储器内存集成电路
页数 文件大小 规格书
30页 771K
描述
144-Mbit DDR II SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)

CY7C1668KV18-450BZXC 技术参数

是否Rohs认证: 符合生命周期:Active
零件包装代码:BGA包装说明:LBGA,
针数:165Reach Compliance Code:compliant
ECCN代码:3A991.B.2.AHTS代码:8542.32.00.41
Factory Lead Time:1 week风险等级:5.77
最长访问时间:0.45 ns其他特性:PIPELINED ARCHITECTURE
JESD-30 代码:R-PBGA-B165JESD-609代码:e1
长度:17 mm内存密度:150994944 bit
内存集成电路类型:DDR SRAM内存宽度:18
功能数量:1端子数量:165
字数:8388608 words字数代码:8000000
工作模式:SYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:8MX18
封装主体材料:PLASTIC/EPOXY封装代码:LBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, LOW PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):260
座面最大高度:1.4 mm最大供电电压 (Vsup):1.9 V
最小供电电压 (Vsup):1.7 V标称供电电压 (Vsup):1.8 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Silver/Copper (Sn/Ag/Cu)
端子形式:BALL端子节距:1 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:40
宽度:15 mmBase Number Matches:1

CY7C1668KV18-450BZXC 数据手册

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CY7C1668KV18  
CY7C1670KV18  
144-Mbit DDR II+ SRAM Two-Word  
Burst Architecture (2.5 Cycle Read Latency)  
144-Mbit DDR II+ SRAM Two-Word Burst Architecture (2.5 Cycle Read Latency)  
Features  
Configurations  
144-Mbit density (8 M × 18, 4 M × 36)  
550-MHz clock for high bandwidth  
With Read Cycle Latency of 2.5 cycles:  
CY7C1668KV18 – 8 M × 18  
CY7C1670KV18 – 4 M × 36  
Two-word burst for reducing address bus frequency  
Double data rate (DDR) interfaces (data transferred at  
1100 MHz) at 550 MHz  
Functional Description  
The CY7C1668KV18, and CY7C1670KV18 are 1.8-V  
synchronous pipelined SRAMs equipped with DDR II+  
architecture. The DDR II+ consists of an SRAM core with  
advanced synchronous peripheral circuitry. Addresses for read  
and write are latched on alternate rising edges of the input (K)  
clock. Write data is registered on the rising edges of both K and  
K. Read data is driven on the rising edges of K and K. Each  
address location is associated with two 18-bit words  
(CY7C1668KV18), or 36-bit words (CY7C1670KV18) that burst  
sequentially into or out of the device.  
Available in 2.5-clock cycle latency  
Two input clocks (K and K) for precise DDR timing  
SRAM uses rising edges only  
Echo clocks (CQ and CQ) simplify data capture in high-speed  
systems  
Data valid pin (QVLD) to indicate valid data on the output  
Synchronous internally self-timed writes  
Asynchronous inputs include an output impedance matching  
input (ZQ). Synchronous data outputs (Q, sharing the same  
physical pins as the data inputs D) are tightly matched to the two  
output echo clocks CQ/CQ, eliminating the need for separately  
capturing data from each individual DDR SRAM in the system  
design.  
DDR II+ operates with 2.5-cycle read latency when DOFF is  
asserted HIGH  
Operates similar to DDR I device with one cycle read latency  
when DOFF is asserted LOW  
[1]  
Core VDD = 1.8 V ± 0.1 V; I/O VDDQ = 1.4 V to VDD  
All synchronous inputs pass through input registers controlled by  
the K or K input clocks. All data outputs pass through output  
registers controlled by the K or K input clocks. Writes are  
conducted with on-chip synchronous self-timed write circuitry.  
Supports both 1.5-V and 1.8-V I/O supply  
High-speed transceiver logic (HSTL) inputs and variable drive  
HSTL output buffers  
For a complete list of related documentation, click here.  
Available in 165-ball fine pitch ball grid array (FBGA) package  
(15 × 17 × 1.4 mm)  
Offered in Pb-free packages  
JTAG 1149.1 compatible test access port  
Phase locked loop (PLL) for accurate data placement  
Selection Guide  
Description  
Maximum operating frequency  
550 MHz  
550  
450 MHz Unit  
450  
790  
980  
MHz  
mA  
Maximum operating current  
× 18  
× 36  
910  
1140  
Note  
1. The Cypress QDR II+ devices surpass the QDR consortium specification and can support V  
= 1.4 V to V  
.
DDQ  
DD  
Cypress Semiconductor Corporation  
Document Number: 001-44062 Rev. *K  
198 Champion Court  
San Jose, CA 95134-1709  
408-943-2600  
Revised December 1, 2017  

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