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CY7C1302V25 PDF预览

CY7C1302V25

更新时间: 2024-01-13 14:08:04
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其他 - ETC /
页数 文件大小 规格书
19页 384K
描述
Memory

CY7C1302V25 数据手册

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CY7C1302V25  
9-Mb Pipelined SRAM with QDR™ Architecture  
Features  
Functional Description  
• Separate independent read and write data ports  
— Supports concurrent transactions  
• 167-MHz clock for high bandwidth  
— 2.5-ns clock-to-valid access time  
• Two-word burst on all accesses  
• Double data rate (DDR) interfaces on both read and  
write ports (data transferred at 333 MHz) @ 167 MHz  
• Two input clocks (K and K)[1] for precise DDR timing  
— SRAM uses rising edges only  
• Two output clocks (C and C) account for clock skew  
and flight time mismatches  
• Single multiplexed address input bus latches address  
inputs for both read and write ports  
• Separate port selects for depth expansion  
• Synchronous internally self-timed writes  
• 2.5V core power supply with HSTL inputs and outputs[1]  
The CY7C1302V25 is a 2.5V synchronous pipelined SRAM  
with QDRarchitecture. QDR architecture consists of two  
separate ports to access the memory array. The Read port has  
dedicated Data Outputs to support Read operations and the  
Write Port has dedicated Data inputs to support Write opera-  
tions. Access to each port is accomplished through a common  
address bus. The Read address is latched on the rising edge  
of the K[1] clock and the Write address is latched on the rising  
edge of K[1] clock. QDR has separate data inputs and data  
outputs to completely eliminate the need to turn-aroundthe  
data bus required with common I/O devices. Accesses to the  
CY7C1302V25 Read and Write ports are completely  
independent of one another. All accesses are initiated  
synchronously on the rising edge of the positive input clock  
(K)[1]. In order to maximize data throughput, both Read and  
Write ports are equipped with DDR interfaces. Therefore, data  
can be transferred into the device on every rising edge of both  
input clocks (K and K)[1] and out of the device on every rising  
edge of the output clock (C and C) thereby maximizing perfor-  
mance while simplifying system design.  
• 13 × 15 mm – 1.0-mm pitch FBGA package, 165 ball  
(11 × 15 matrix)  
• Variable-drive HSTL output buffers  
• Expanded HSTL output voltage (1.4V–1.9V)  
• JTAG interface  
Depth expansion is accomplished with Port Select inputs for  
each port. This allows the ports to operate independently.  
All synchronous inputs pass through input registers controlled  
by the input clocks (K and K)[1]. All data outputs pass through  
output registers controlled by the output clocks (C or C). Writes  
occur with on-chip synchronous self-timed write circuitry.  
• Variable impedance HSTL  
Logic Block Diagram  
D[17:0]  
18  
Write  
Write  
Data Reg  
Data Reg  
Address  
Register  
A
l17:0]  
Address  
Register  
A[17:0]  
18  
18  
256Kx18 256Kx18  
Memory Memory  
K[1]  
K[1]  
Array  
Array  
CLK  
Gen.  
RPS  
Control  
Logic  
C
C
Read Data Reg.  
36  
18  
Vref  
18  
Reg.  
Reg.  
Reg.  
18  
18  
Control  
Logic  
WPS  
BWS0  
18  
Q[17:0]  
BWS1  
Note:  
1. K and K inputs require VIH to be greater than VREF + 0.5V and VIL to be less than VREF 0.5V. This is a subset of JEDEC standards for HSTL I/Os.  
Cypress Semiconductor Corporation  
Document #: 38-05260 Rev. *B  
3901 North First Street  
San Jose, CA 95134  
408-943-2600  
Revised November 12, 2002  

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