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CURC301-G_12 PDF预览

CURC301-G_12

更新时间: 2024-10-02 12:20:47
品牌 Logo 应用领域
上华 - COMCHIP 二极管快恢复二极管超快恢复二极管
页数 文件大小 规格书
4页 105K
描述
SMD Ultra Fast Recovery Rectifiers

CURC301-G_12 数据手册

 浏览型号CURC301-G_12的Datasheet PDF文件第2页浏览型号CURC301-G_12的Datasheet PDF文件第3页浏览型号CURC301-G_12的Datasheet PDF文件第4页 
SMD Ultra Fast Recovery Rectifiers  
CURC301-G Thru. CURC307-G  
Reverse Voltage: 50 to 1000 Volts  
Forward Current: 3.0 Amp  
RoHS Device  
Features  
DO-214AB (SMC)  
-Ideal for surface mount applications.  
-Easy pick and place.  
0.280(7.11)  
0.260(6.60)  
-Plastic package has Underwriters Lab.  
flammability classification 94V-0.  
0.245(6.22)  
0.220(5.59)  
0.126(3.20)  
0.114(2.90)  
-Fast recovery time: 50~75nS.  
-Low leakage current.  
0.320(8.13)  
0.305(7.75)  
Mechanical data  
0.012(0.305)  
0.006(0.152)  
-Case: JEDEC DO-214AB, molded plastic.  
0.103(2.62)  
0.079(2.06)  
-Terminals: solderable per MIL-STD-750,  
method 2026.  
0.008(0.203)Max  
0.060(1.52)  
0.030(0.76)  
-Polarity: Color band denotes cathode end.  
-Approx. weight: 0.21 grams  
Dimensions in inches and (millimeter)  
Maximum Ratings and Electrical Characteristics  
CURC  
301-G  
CURC  
302-G  
CURC  
303-G  
CURC  
304-G  
CURC  
305-G  
CURC  
306-G  
CURC  
307-G  
Parameter  
Symbol  
Units  
Max. repetitive peak reverse voltage  
Max. DC blocking voltage  
Max. RMS voltage  
VRRM  
VDC  
50  
50  
35  
100  
100  
70  
200  
200  
140  
400  
400  
280  
600  
600  
420  
800  
800  
560  
1000  
1000  
700  
V
V
V
VRMS  
Peak surge forward current, 8.3ms  
single half sine-wave superimposed  
on rate load (JEDEC method)  
IFSM  
IO  
100  
A
A
3.0  
1.3  
Max. average forward current  
Max. instantaneous forward voltage at  
3.0A  
VF  
Trr  
1.0  
1.7  
75  
V
50  
nS  
Reverse recovery time  
Max. DC reverse current at TA=25 OC  
rated DC blocking voltage TA=125 OC  
5.0  
150  
IR  
μA  
RθJL  
TJ  
Max. thermal resistance (Note 1)  
Max. operating junction temperature  
Storage temperature  
20  
150  
OC/W  
OC  
OC  
TSTG  
-55 to +150  
2
Notes: 1. Thermal resistance from junction to lead mounted on P.C.B. with 8.0×8.0 mm square land area.  
REV:B  
Page 1  
QW-BU004  
Comchip Technology CO., LTD.  

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