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CURC302 PDF预览

CURC302

更新时间: 2024-10-01 22:17:11
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上华 - COMCHIP /
页数 文件大小 规格书
2页 71K
描述
SMD Ultra Fast Recovery Rectifier

CURC302 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
Reach Compliance Code:compliantECCN代码:EAR99
风险等级:5.92Base Number Matches:1

CURC302 数据手册

 浏览型号CURC302的Datasheet PDF文件第2页 
SSMMDD UUllttrraa FFaasstt RReeccoovveerryy RReeccttiiffiieerr  
CCOOMMCCHHIIPP  
www.comchip.com.tw  
CURC301 Thru CURC307  
Reverse Voltage: 50 - 1000 Volts  
Forward Current: 3.0 Amp  
Features  
Ideal for surface mount applications  
Easy pick and place  
SMC/DO-214AB  
Plastic package has Underwriters Lab.  
flammability classification 94V-0  
0.124(3.15)  
0.245(6.22)  
0.220(5.59)  
Fast recovery time: 50 - 75 nS  
Low leakage current  
0.108(2.75)  
0.280(7.11)  
0.260(6.60)  
0.012(0.31)  
0.006(0.15)  
Mechanical data  
Case: JEDEC DO-214AB molded plastic  
0.103(2.62)  
0.079(2.00)  
Terminals: solderable per MIL-STD-750,  
method 2026  
0.008(0.20)  
0.050(1.27)  
0.030(0.76)  
Polarity: Color band denotes cathode  
end  
0.0203(0.10)  
0.320(8.13)  
0.305(7.75)  
Mounting position: Any  
Dimensions in inches and (millimeter)  
Approx. Weight: 0.21 gram  
Maximum Ratings and Electrical Characterics  
CURC  
301  
CURC CURC  
CURC CURC  
CURC CURC  
Unit  
Symbol  
VRRM  
VDC  
Parameter  
302  
303  
304  
305  
306  
307  
200  
400  
600  
50  
50  
35  
800  
1000  
Max. Repetitive PeakReverse Voltage  
Max. DC BlockingVoltage  
Max. RMS Voltage  
100  
V
V
V
200  
400  
600  
800  
560  
1000  
700  
100  
70  
VRMS  
140  
280  
420  
Peak Surge ForwardCurrent  
8.3ms single halfsine-wave  
superimposed on rateload  
( JEDEC method)  
IFSM  
A
100  
I o  
3.0  
Max. Average Forward Current  
A
Max. Instantaneous ForwardCurrent  
at 3.0 A  
1.3  
1.7  
1.0  
V F  
V
Trr  
Reverse recovery time  
50  
nS  
75  
Max. DC ReverseCurrent at RatedDC  
I R  
5.0  
Blocking Voltage  
Ta=25 C  
Ta=100C  
uA  
100  
15  
R
JL  
Max. Thermal Resistance(Note 1)  
Operating Junction Temperature  
Storage Temperature  
C/W  
- 5 5 t o + 1 5 0  
T j  
C
- 5 5 t o + 1 5 0  
TSTG  
C
Note 1: Thermal resistance from junction to lead, 8.0x8.0mm square (0.13 mm thick) land areas.  
Page 1  
MDS0210015B  

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