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CS4412-CNZ PDF预览

CS4412-CNZ

更新时间: 2024-02-28 02:48:29
品牌 Logo 应用领域
凌云 - CIRRUS 放大器
页数 文件大小 规格书
22页 317K
描述
Audio Amplifier, 30W, 4 Channel(s), 1 Func, 9 X 9 MM, LEAD FREE, QFN-48

CS4412-CNZ 技术参数

是否Rohs认证:符合生命周期:Obsolete
零件包装代码:QFN包装说明:HVQCCN, LCC48,.35SQ,25
针数:48Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8542.33.00.01
风险等级:5.84Is Samacsys:N
商用集成电路类型:AUDIO AMPLIFIERJESD-30 代码:S-XQCC-N48
长度:9 mm信道数量:4
功能数量:1端子数量:48
最高工作温度:70 °C最低工作温度:-40 °C
标称输出功率:30 W封装主体材料:UNSPECIFIED
封装代码:HVQCCN封装等效代码:LCC48,.35SQ,25
封装形状:SQUARE封装形式:CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
电源:2.5/5 V认证状态:Not Qualified
座面最大高度:0.9 mm子类别:Audio/Video Amplifiers
最大供电电压 (Vsup):2.625 V最小供电电压 (Vsup):2.375 V
表面贴装:YES温度等级:OTHER
端子形式:NO LEAD端子节距:0.65 mm
端子位置:QUAD宽度:9 mm
Base Number Matches:1

CS4412-CNZ 数据手册

 浏览型号CS4412-CNZ的Datasheet PDF文件第16页浏览型号CS4412-CNZ的Datasheet PDF文件第17页浏览型号CS4412-CNZ的Datasheet PDF文件第18页浏览型号CS4412-CNZ的Datasheet PDF文件第19页浏览型号CS4412-CNZ的Datasheet PDF文件第20页浏览型号CS4412-CNZ的Datasheet PDF文件第22页 
CS4412  
8. THERMAL CHARACTERISTICS  
Parameter  
Symbol  
Min  
Typ  
Max  
Units  
Junction to Case Thermal Impedance  
θJC  
-
1
-
°C/Watt  
8.1  
Thermal Flag  
This device is designed to have the metal flag on the bottom of the device soldered directly to a metal plane  
on the PCB. To enhance the thermal dissipation capabilities of the system, this metal plane should be cou-  
pled with vias to a large metal plane on the backside (and inner ground layer, if applicable) of the PCB.  
In either case, it is beneficial to use copper fill in any unused regions inside the PCB layout, especially those  
immediately surrounding the CS4412. In addition to improving in electrical performance, this practice also  
aids in heat dissipation.  
The heat dissipation capability required of the metal plane for a given output power can be calculated as  
follows:  
θ
= [(T  
- T ) / P ] - θ  
J(MAX) A D JC  
CA  
where,  
= Thermal resistance of the metal plane in °C/Watt  
θ
CA  
T
= Maximum rated operating junction temperature in °C, equal to 150 °C  
J(MAX)  
T = Ambient temperature in °C  
A
P = RMS power dissipation of the device, equal to 0.15*P  
or 0.176*P (assuming 85% effi-  
RMS-OUT  
D
RMS-IN  
ciency)  
θ
= Junction-to-case thermal resistance of the device in °C/Watt  
JC  
DS749A1  
21  

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