CRSM027N08N4
SkyMOS4 N-MOSFET 80V, 2.5mΩ, 195A
华润微电子(重庆)有限公司
Thermal Resistance
Value
typ.
Parameter
Symbol
RthJC
Unit
Test Condition
-
min.
-
max.
0.80
Thermal resistance,
junction – case.
0.5
-
°C/W
Thermal resistance,
junction - ambient(min.
footprint)
RthJA
-
55
°C/W
-
Electrical Characteristic (at Tj = 25 °C, unless otherwise specified)
Value
Symbol
Parameter
Unit
Test Condition
min.
typ.
max.
Static Characteristic
Drain-source breakdown
voltage
BVDSS
VGS=0V, ID=250uA
VDS=VGS,ID=250uA
80
-
-
V
V
VGS(th )
Gate threshold voltage
2.2
3
3.8
VDS=80V,VGS=0V
Tj=25°C
Zero gate voltage drain
current
-
-
-
-
1
IDSS
μA
Tj=125°C
100
Gate-source leakage
current
IGSS
VGS=±20V,VDS=0V
-
±100
2.8
nA
Drain-source on-state
resistance
RDS(on)
VGS=10V,ID=50A
2
2.5
mΩ
VGS=8V,ID=40A
VDS=5V,ID=50A
2.04
90
2.6
3.8
mΩ
S
gfs
Transconductance
113
147
Dynamic Characteristic
Input Capacitance
Ciss
3680
660
5520
990
8280
1485
VGS=0V, VDS=40V,
f=1MHz
Coss
Output Capacitance
pF
Reverse Transfer
Capacitance
Crss
21
32
64
QG
Qgs
Qgd
td(on)
tr
Gate Total Charge
Gate-Source charge
Gate-Drain charge
Turn-on delay time
Rise time
51
20
6
76
30
9
114
45
VGS=10V, VDS=40V,
ID=50A, f=1MHz
nC
18
14
61
30
63
21
92
45
94
32
137
68
VGS=10V, VDD=40V,
RG_ext=2.7Ω
ns
Ω
td(off)
tf
Turn-off delay time
Fall time
141
VGS=0V, VDS=0V,
f=1MHz
RG
Gate resistance
1.2
1.8
2.6
Rev 1.0
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