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CRF05-1AS PDF预览

CRF05-1AS

更新时间: 2024-09-26 03:26:47
品牌 Logo 应用领域
MEDER 继电器
页数 文件大小 规格书
5页 808K
描述
7 GHz High Frequency Reed Relay for 50ohm Impedance

CRF05-1AS 技术参数

生命周期:ActiveReach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8536.49.00.50
风险等级:1.49主体宽度:4.4 mm
主体高度:3.4 mm主体长度或直径:8.6 mm
最大线圈电流(直流):0.026 A线圈工作电压(直流):2.25 V
线圈功率:129 mW线圈释放电压(直流):0.45 V
线圈电阻:70 Ω最大线圈电压(直流):5 V
线圈/输入电源类型:DC触点(交流)最大额定R负载:.5A@170VAC
最大触点电流(交流):0.5 A最大触点电流(直流):0.5 A
触点(直流)最大额定R负载:.5A@170VDC最大触点电压(交流):170 V
最大触点电压(直流):170 V触点/输出电源类型:AC/DC
电气寿命:1000000000 Cycle(s)JESD-609代码:e4
安装特点:SURFACE MOUNT-STRAIGHT工作时间:0.1 ms
最大工作频率:7000 MHz最高工作温度:125 °C
最低工作温度:-40 °C物理尺寸:8.6mm x 4.4mm x 3.4mm
继电器动作:MOMENTARY继电器功能:SPST
继电器类型:DRY REED RELAY释放时间:0.02 ms
表面贴装:NO端子面层:GOLD
端接类型:SOLDERBase Number Matches:1

CRF05-1AS 数据手册

 浏览型号CRF05-1AS的Datasheet PDF文件第2页浏览型号CRF05-1AS的Datasheet PDF文件第3页浏览型号CRF05-1AS的Datasheet PDF文件第4页浏览型号CRF05-1AS的Datasheet PDF文件第5页 
MEDER electronic  
CRF Series  
7 GHz High Frequency Reed  
Relay for 50 Impedance  
DESCRIPTION  
The MEDER CRF Series Reed Relay is a low-profile  
device made with a ceramic case that exactly matches  
the thermal coefficient of expansion of the reed switch  
glass and the reed lead to eliminate any potential  
packaging stress. Capable of switching up to 7 GHz  
with <40 ps rise times for digital operations, this leadless  
50 Ohm reed relay is the smallest in the industry and  
switches into the billions of operations.  
FEATURES  
Ceramic / thermoset molded package  
Patent pending  
Smallest in the industry  
No lead frame surface mount design eliminates  
skewing of leads and coplanarity issues  
No internal solder connections  
Minimum path length for RF  
Up to 7 GHz switching frequencies  
Ability to switch fast pulses with rise times of 40  
pico seconds or less  
Capable of withstanding reflow-soldering operations up  
to 260°C, the relay uses no internal solder and has 1  
µV typical thermal offset. Measuring only 8.6 mm x 4.4  
mm x 3.4 mm, the leadless design eliminates skewing  
of leads and co-planarity issues.  
Available with BGA  
Internal magnetic shield standard  
Very low profile  
APPLICATIONS  
Test and measurement  
Medical Equipment  
Telecommunications  
High frequency applications  
Gold plated leads for high conductivity RF path  
Low thermal offset typical 1 µV  
TCE matching of all internal components  
Insulation resistance typical 1014 ohms  
3 Volt option available  
DIMENSIONS (Non-BGA)  
*All dimensions in mm (inches)  
PAD LAYOUT  
PIN OUT  
PCB LAYOUT  
(Bottom View)  
(Top View)  
3.60  
[0.1417]  
0.50  
[0.0197]  
1.20  
[0.0472]  
Ø
[Ø  
0.95  
0.0031]  
0.70  
[0.0276]  
10x R0.475  
[0.187]  
1.20  
[0.0472]  
0.95  
[0.0374]  
3.125  
[0.123]  
9.60  
[0.378]  
www.meder.com  
251  

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